Master Bond EP21TPND Non Drip Polysulfide Based Two Component Adhesive System

Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. EP21TPND can be applied without sagging or dripping even on vertical surfaces.