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Master Bond EP112M Two Component, Medium Viscosity Heat Curing Cycloaliphatic Epoxy Resin

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP112M Two Component, Medium Viscosity Heat Curing Cycloaliphatic Epoxy Resin.pdf
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Material Notes:
Product Description: Master Bond Polymer System EP112M is a solventless, medium viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications featuring outstanding arc, corona and tracking resistance. The two components are combined in a convenient noncritical mix ratio (100/80 by wt) to a medium viscosity, 100% reactive liquid with a long working (pot) life at ambient temperatures which however cures readily at elevated temperatures to a tough strong solid with superior physical strength properties and outstanding electrical insulation characteristics. Additional performance qualities are high thermal and dimensional stability, very good thermal shock and vibration resistance and excellent adhesion to metals and a variety of other substrates including glass fibers, ceramics and many plastics. The formulated chemical composition of the Master Bond Polymer System EP112M assures high and durable outdoor electrical insulation properties such as tracking resistance, erosion resistance and weather resistance as well as adhesion to reinforcing fibers for epoxy composites over a wide temperature range. Master Bond Polymer System EP112M is widely employed for potting, casting and encapsulation applications, impregnations and the production of glass and/or other reinforcing fibers in epoxy structures such as pipe, tanks, electrical insulation tubing etc. Because of the retention of its outdoor electrical insulation characteristics, formulations based on Master Bond Polymer System EP112M are successfully employed in electrical insulation applications including outdoor post and suspension insulators; outdoor high and low voltage transformer bushings; outdoor switchgear components-resistor housings; interruptor tubes and outdoor instrument transformers. Master Bond Polymer System EP112M is filled with a specially formulated blend of ceramic powders which serve to optimize the system’s arc, corona and tracking resistance. Product Advantages:Convenient noncritical mixing ratio (A/B 100/80 by wt).Medium viscosity, long working (pot) life at ambient temperatures, ready cure at elevated temperatures (250 to 350°F).High physical strengths, toughness, resiliency; resists cracking around metal inserts.Excellent dielectric properties are constant over a wide range of temperatures.Superior arc, corona and tracking resistance.Good endurance under outdoor exposures exhibited by superior ultraviolet and thermal shock resistance.Low shrinkage upon cure.Excellent adhesion to both metallic and nonmetallic substrates.High thermal stability (HDT >190°C (350°F). Service temperature -60°F to 500°F.Good water and chemical resistance.Low density.Ready modification with selected resins and other compounding ingredients to maximize specific application requirements.Information provided by MasterBond®
Mechanical Properties Metric English Comments
Hardness, Shore D >= 90
>= 90
Tensile Strength at Break >= 34.5 MPa

@Temperature 149 °C
>= 5000 psi

@Temperature 300 °F
>= 68.9 MPa

@Temperature 23.9 °C
>= 10000 psi

@Temperature 75.0 °F
Tensile Modulus 1.86 GPa

@Temperature 149 °C
270 ksi

@Temperature 300 °F
3.72 GPa

@Temperature 23.9 °C
540 ksi

@Temperature 75.0 °F
Flexural Strength 137 MPa
19800 psi
Compressive Strength >= 190 MPa
>= 27600 psi
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 260 °C
500 °F
Heat Distortion Temperature 193 °C
380 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Shrinkage 0.15 - 0.20 %
0.15 - 0.20 %
Cure shrinkage
Electrical Properties Metric English Comments
Volume Resistivity >= 1.50e+15 ohm-cm

@Temperature 300 °C
>= 1.50e+15 ohm-cm

@Temperature 572 °F
>= 1.00e+16 ohm-cm

@Temperature 75.0 °C
>= 1.00e+16 ohm-cm

@Temperature 167 °F
Surface Resistance 3.90e+14 ohm

@Temperature 149 °C
3.90e+14 ohm

@Temperature 300 °F
4.80e+15 ohm

@Temperature 23.9 °C
4.80e+15 ohm

@Temperature 75.0 °F
Dielectric Constant 3.08

@Frequency 60.0 Hz,
Temperature 150 °C
3.08

@Frequency 60.0 Hz,
Temperature 302 °F
3.16

@Frequency 60.0 Hz,
Temperature 25.0 °C
3.16

@Frequency 60.0 Hz,
Temperature 77.0 °F
Dielectric Strength 17.7 kV/mm
450 kV/in
125 mil
Dissipation Factor 0.0060

@Frequency 60.0 Hz,
Temperature 150 °C
0.0060

@Frequency 60.0 Hz,
Temperature 302 °F
0.0090

@Frequency 60.0 Hz,
Temperature 25.0 °C
0.0090

@Frequency 60.0 Hz,
Temperature 77.0 °F
Arc Resistance >= 200 sec
>= 200 sec
ASTM D495
Track Resistance >= 120000 sec
>= 120000 sec
2.5 KV; ASTM D2303
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 104 - 121 °C
2.00 - 3.00 hour

@Temperature 220 - 250 °F
first
240 - 360 min

@Temperature 149 - 160 °C
4.00 - 6.00 hour

@Temperature 300 - 320 °F
second, Post cure for and additional 4-8 hours at 350-375°F
Pot Life >= 6.0 min
>= 6.0 min
at ambient temperatures
Shelf Life 12.0 Month
12.0 Month
unopened containers
Descriptive Properties Value Comments
Mixing Ratio (A to B) 100/80
by weight
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