Category | Polymer , Thermoset , Silicone , Silicone, RTV, Encapsulation Grade |
Manufacturer | Lord Adhesives |
Trade Name | Thermoset™ |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Lord Adhesives Thermosetâ„¢ SC-300M Silicone Gel Encapsulant.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Specific Gravity | 0.990 g/cc | 0.990 g/cc | STM 2 |
Volatiles | 0.010 % | 0.010 % | |
Viscosity | 200 cP | 200 cP | STM 1 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Penetration | 5.0 @Load 0.0195 kg |
5.0 @Load 0.0430 lb |
mm |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 0.326 µm/m-°C @Temperature 25.0 °C |
0.181 µin/in-°F @Temperature 77.0 °F |
|
Thermal Conductivity | 0.154 W/m-K | 1.07 BTU-in/hr-ft²-°F | ASTM D2214 |
Maximum Service Temperature, Air | 200 °C | 392 °F |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 9.90e+14 ohm-cm @Temperature 25.0 °C |
9.90e+14 ohm-cm @Temperature 77.0 °F |
ASTM D257 |
Dielectric Constant | 2.7 @Frequency 100000 Hz, Temperature 25.0 °C |
2.7 @Frequency 100000 Hz, Temperature 77.0 °F |
ASTM D150 |
Dissipation Factor | 0.0050 @Frequency 100000 Hz, Temperature 25.0 °C |
0.0050 @Frequency 100000 Hz, Temperature 77.0 °F |
ASTM D150 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 1440 min @Temperature 25.0 °C |
24.0 hour @Temperature 77.0 °F |
|
Pot Life | 30 min @Temperature 25.0 °C |
30 min @Temperature 77.0 °F |
|
Gel Time | 50.0 min @Temperature 25.0 °C |
50.0 min @Temperature 77.0 °F |
|
Shelf Life | 6.00 Month @Temperature 25.0 °C |
6.00 Month @Temperature 77.0 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Mix Ratio | 1:1 | by weight, by volume |