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Lord Adhesives Thermosetâ„¢ MD-110 Conductive Adhesive

Category Polymer , Adhesive
Manufacturer Lord Adhesives
Trade Name Thermoset™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Lord Adhesives Thermosetâ„¢ MD-110 Conductive Adhesive.pdf
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Material Notes:
LORD Thermosetâ„¢ MD-110 silver-filled conductive adhesive offers excellent electrical conductivity and room temperature stability. It is designed for use with automated dispensing, stamping and screen-printing application equipment.Thermoset MD-110 adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications.All information provided by Lord.
Physical Properties Metric English Comments
Specific Gravity 4.20 g/cc
4.20 g/cc
Viscosity 150000 cP

@Temperature 25.0 °C
150000 cP

@Temperature 77.0 °F
Mechanical Properties Metric English Comments
Modulus of Elasticity 3.20 GPa

@Temperature 25.0 °C
464 ksi

@Temperature 77.0 °F
Storage
Shear Strength 48.3 MPa

@Temperature 25.0 °C
7000 psi

@Temperature 77.0 °F
Die
Thermal Properties Metric English Comments
CTE, linear 80.0 µm/m-°C
44.4 µin/in-°F
Alpha 1
250 µm/m-°C
139 µin/in-°F
Alpha 2
Glass Transition Temp, Tg 60.0 °C
140 °F
TMA
Component Elements Properties Metric English Comments
Potassium, K <= 0.00050 %
<= 0.00050 %
Sodium, Na <= 0.00050 %
<= 0.00050 %
Electrical Properties Metric English Comments
Volume Resistivity 80000 ohm-cm

@Temperature 25.0 °C
80000 ohm-cm

@Temperature 77.0 °F
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 150 °C
0.250 hour

@Temperature 302 °F
30.0 min

@Temperature 130 °C
0.500 hour

@Temperature 266 °F
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Appearance Silver
Chloride (%) < 0.0016
Consistency Paste
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