Loctite® CHIPBONDER® 3609 Syringe Dispense

Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application techniques including syringe dispense, stencil print and pin transfer.Loctite® syringe dispense products provide good performance for electronics assembly:High Speed DispenseLow Temperature CureProducts for difficult-to-bond substratesLoctite® 3609 CHIPBONDER® Syringe DispenseFor high speed dot placement. Good green strength. A choice of colors for best vision pickup on light or dark surfaces.Peaked dot profile. Process Method:Medium speedSyringe dispensing18,000 DPH capable Storage (Protect from heat): 40°F (+/-5°F) or 5°C (+/-3°C)