Hexcel® Redux® 382H (0.03 psf) Film Adhesive

Redux 382H is a 250°F curing modified epoxy film adhesive available in both supported and unsupported versions. Redux 382H is a versatile adhesive system suitable for bonding a wide variety of substrates with various temperature cure cycles.Features: Superior bonding capability on substrates with high moisture contents; Low volatile content allows use with perforated and non-perforated core materials; Excellent environmental resistance when tested to US-Military Specification MMM-A-132; Handling characteristics minimize shop handling and lay up times; Meets requirements of US Specifications: MMM-A-132, MILK-A-25462, and ASTM-E865-82.Applications: Redux 382H is adaptable to high and low temperature cure cycles normally associated with large scale metal to metal and sandwich panel bonding. Redux 382H gives superior mechanical properties on metal, wood and paper substrates.