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Hexcel® HexPly® 954-3 Curing Cyanate Resin

Category	Polymer , Thermoset , Epoxy
Manufacturer	Hexcel
Trade Name	HexPly®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Hexcel® HexPly® 954-3 Curing Cyanate Resin.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

HexPly® 954-3 is a 350°F (177°C) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding using a standard cure of two hours at 350°F (177°C). Glass transition temperature can be maximized by post curing at 450°F (232°C). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C2.Typical applications for HexPly® 954-3 include primary and secondary space structures and other applications where dimensional stability is critical.Information provided by HexCel

Physical Properties	Metric	English	Comments
Density	1.19 g/cc	0.0430 lb/in³
Water Absorption	0.70 %	0.70 %	50% GH/EQ
Moisture Absorption at Equilibrium	0.18 %	0.18 %	55% RH/EQ
Outgassing - Total Mass Loss	0.20 %	0.20 %	954-3; ASTM E595
	1.0 %	1.0 %	ASTM LIMITS; ASTM E595
Collected Volatile Condensable Material	0.010 %	0.010 %	954-3; ASTM E595
	0.10 %	0.10 %	ASTM LIMITS; ASTM E595

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	57.0 MPa @Temperature 23.0 °C	8270 psi @Temperature 73.4 °F
Elongation at Break	2.4 %	2.4 %
Tensile Modulus	2.80 GPa @Temperature 23.0 °C	406 ksi @Temperature 73.4 °F
Flexural Yield Strength	77.0 MPa @Temperature 163 °C	11200 psi @Temperature 325 °F	Wet (7 day immersion at 71°C)
	87.0 MPa @Temperature 163 °C	12600 psi @Temperature 325 °F
	119 MPa @Temperature 23.0 °C	17300 psi @Temperature 73.4 °F
Flexural Modulus	2.10 GPa @Temperature 163 °C	305 ksi @Temperature 325 °F	Wet (7 day immersion at 71°C)
	2.30 GPa @Temperature 163 °C	334 ksi @Temperature 325 °F
	3.00 GPa @Temperature 23.0 °C	435 ksi @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
CTE, linear	55.1 µm/m-°C	30.6 µin/in-°F
Glass Transition Temp, Tg	206 °C	403 °F	No post cure
	258 °C	496 °F	With post cure

Electrical Properties	Metric	English	Comments
Dielectric Constant	2.73 @Frequency 1.00e+10 Hz, Temperature 23.0 °C	2.73 @Frequency 1.00e+10 Hz, Temperature 73.4 °F	Unconditioned; ASTM D2520
	2.73 @Frequency 1.00e+10 Hz, Temperature 163 °C	2.73 @Frequency 1.00e+10 Hz, Temperature 325 °F	Unconditioned; ASTM D2520
	2.85 @Frequency 1.00e+10 Hz, Temperature 23.0 °C	2.85 @Frequency 1.00e+10 Hz, Temperature 73.4 °F	Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520
	2.85 @Frequency 1.00e+10 Hz, Temperature 163 °C	2.85 @Frequency 1.00e+10 Hz, Temperature 325 °F	Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520
Dielectric Loss Index	0.0060 @Frequency 1.00e+10 Hz, Temperature 23.0 °C	0.0060 @Frequency 1.00e+10 Hz, Temperature 73.4 °F	Unconditioned; ASTM D2520
	0.0080 @Frequency 1.00e+10 Hz, Temperature 163 °C	0.0080 @Frequency 1.00e+10 Hz, Temperature 325 °F	Unconditioned; ASTM D2520
	0.010 @Frequency 1.00e+10 Hz, Temperature 23.0 °C	0.010 @Frequency 1.00e+10 Hz, Temperature 73.4 °F	Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520
	0.020 @Frequency 1.00e+10 Hz, Temperature 163 °C	0.020 @Frequency 1.00e+10 Hz, Temperature 325 °F	Moisture conditioned (71°C and 95% RH for 140 days); ASTM D2520

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