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Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also available in a frozen syringe.Advantages & Application Notes: Designed specifically to meet the requirements pertaining to the MIL-STD 883/Test Method 5011 for military hybrids.Can be considered a lower stress, and lower cure temperature alternative to EPO-TEK® H35-175MP.Compliant material; eliminates cracking when bonding large components or substrates. Excellent adhesion to ceramic, Si, Au, kovar, Au/kovar and AgPd.May also be used on lead-frames and die-paddles compatible with JEDEC plastic IC packaging.Adaptable to conventional processing methods such as automatic dispensing or screen printing.Passes NASA low outgassing standard ASTM E595 with proper cureInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 3.07 g/cc
3.07 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 22000 - 26000 cP

@Temperature 23.0 °C
22000 - 26000 cP

@Temperature 73.4 °F
10 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 5.0172 GPa
727.68 ksi
Storage
Shear Strength 13.0 MPa
1880 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 52.0 µm/m-°C
28.9 µin/in-°F
Below Tg
148 µm/m-°C
82.2 µin/in-°F
Above Tg
Thermal Conductivity 1.59 W/m-K
11.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 90.0 °C
>= 194 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 358 °C
676 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) <= 50 ppm
<= 50 ppm
Ionic Impurities - K (Potassium) <= 50 ppm
<= 50 ppm
Ionic Impurities - Cl (Chloride) <= 200 ppm
<= 200 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Smooth flowing paste
Ionic Impurities NH4 65 ppm
Number of Components Single
Thixotropic Index 3.62
Weight Loss 0.13%
200°C
0.41%
250°C
0.8%
300°C
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