Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy

Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach.Advantages & Application Notes: Flexible alternative to EPO-TEK® H20E, designed to offer lower stress, less cracking, and more flexibility. Rheology provides a very soft, smooth, thixotropic paste. No solvents are present.A film suitable for Kapton or Mylar can be flexed 180 degrees and creased without de-lamination or loss of conductivity; can be used instead of conductive silicone RTVs.Can be applied by screen printing, stamping, roller coating techniques; or hand applied. Recommended for fiber-optic packaging. Also suggested for bonding SAW devices, as a low stress adhesive.Applications or end-use could be speaker or microphone circuit related.Hybrid level die attach epoxy capable of resisting wire bonding operations. Also, lid sealing operations will not affect bonded chips in the package.Suggested as a low stress conductive adhesive for large die sizes, as well as oversized components or substrates.Information Provided by Epoxy Technology