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- Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy
Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 3.71 g/cc | 3.71 g/cc | Part A |
| 4.09 g/cc | 4.09 g/cc | Part B | |
| Particle Size | <= 45 µm | <= 45 µm | |
| Viscosity | 24000 - 46000 cP @Temperature 23.0 °C |
24000 - 46000 cP @Temperature 73.4 °F |
5 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 72 | 72 | |
| Tensile Modulus | 3.40 GPa | 494 ksi | Storage |
| Shear Strength | 9.046 MPa | 1312 psi | Lap |
| >= 11.7 MPa | >= 1700 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 37.0 µm/m-°C | 20.6 µin/in-°F | Below Tg |
| 219 µm/m-°C | 122 µin/in-°F | Above Tg | |
| Thermal Conductivity | 1.84 W/m-K | 12.8 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 225 °C | 437 °F | Continuous |
| 325 °C | 617 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 50.0 °C | >= 122 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 402 °C | 756 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00050 ohm-cm | <= 0.00050 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 18 ppm | 18 ppm | |
| Ionic Impurities - K (Potassium) | 2.0 ppm | 2.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 295 ppm | 295 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 15.0 min @Temperature 120 °C |
0.250 hour @Temperature 248 °F |
minimum |
| Pot Life | 240 min | 240 min | |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | Part A |
| Silver | Part B | |
| Consistency | Smooth thixotropic paste | |
| Ionic Impurities NH4 | 29 ppm | |
| Mix Ratio By Weight | 4:1 | |
| Number of Components | Two | |
| Thixotropic Index | 5.3 | |
| Weight Loss | 0.06% | 200°C |
| 0.1% | 250°C | |
| 0.22% | 300°C |
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