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Epoxy Technology EPO-TEK® EK2000 Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® EK2000 Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques. It is a two component version of EPO-TEK® EK1000.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	3.82 g/cc	3.82 g/cc	Part A
	3.88 g/cc	3.88 g/cc	Part B
Particle Size	<= 45 µm	<= 45 µm
Viscosity	1686 cP @Temperature 23.0 °C	1686 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	66	66
Tensile Modulus	1.89 GPa	274 ksi	Storage
Shear Strength	6.96 MPa	1010 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die after 1000 hrs 85C/85%R
	>= 23.4 MPa	>= 3400 psi	Die Initial

Thermal Properties	Metric	English	Comments
CTE, linear	38.0 µm/m-°C	21.1 µin/in-°F	Below Tg
	94.0 µm/m-°C	52.2 µin/in-°F	Above Tg
Thermal Conductivity	12.6 W/m-K @Temperature 150 °C, Time 3600 sec	87.4 BTU-in/hr-ft²-°F @Temperature 302 °F, Time 1.00 hour
	26.3 W/m-K @Temperature 150 °C, Time 3600 sec	183 BTU-in/hr-ft²-°F @Temperature 302 °F, Time 1.00 hour	+200°C/1 hr
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 104 °C	>= 219 °F
Decomposition Temperature	357 °C	675 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.000090 ohm-cm	<= 0.000090 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	2.0 ppm	2.0 ppm
Ionic Impurities - K (Potassium)	0.00 ppm	0.00 ppm
Ionic Impurities - Cl (Chloride)	<= 10 ppm	<= 10 ppm

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 200 °C	0.500 hour @Temperature 392 °F	minimum
Pot Life	20160 min	20160 min
Shelf Life	12.0 Month	12.0 Month	refrigerated upon arrival

Descriptive Properties	Value	Comments
Color	Silver	Part A
	Silver	Part B
Consistency	Smooth thixotropic paste
Ionic Impurities NH4	6 ppm
Mix Ratio By Weight	1:1
Number of Components	Two
Thixotropic Index	3.6
Weight Loss	0.19%	200°C
	0.94%	250°C
	1.7%	300°C

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