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Epoxy Technology EPO-TEK® EK2000 Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® EK2000 Epoxy.pdf
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Material Notes:
Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques. It is a two component version of EPO-TEK® EK1000.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 3.82 g/cc
3.82 g/cc
Part A
3.88 g/cc
3.88 g/cc
Part B
Particle Size <= 45 µm
<= 45 µm
Viscosity 1686 cP

@Temperature 23.0 °C
1686 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 66
66
Tensile Modulus 1.89 GPa
274 ksi
Storage
Shear Strength 6.96 MPa
1010 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die after 1000 hrs 85C/85%R
>= 23.4 MPa
>= 3400 psi
Die Initial
Thermal Properties Metric English Comments
CTE, linear 38.0 µm/m-°C
21.1 µin/in-°F
Below Tg
94.0 µm/m-°C
52.2 µin/in-°F
Above Tg
Thermal Conductivity 12.6 W/m-K

@Temperature 150 °C,
Time 3600 sec
87.4 BTU-in/hr-ft²-°F

@Temperature 302 °F,
Time 1.00 hour
26.3 W/m-K

@Temperature 150 °C,
Time 3600 sec
183 BTU-in/hr-ft²-°F

@Temperature 302 °F,
Time 1.00 hour
+200°C/1 hr
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 104 °C
>= 219 °F
Decomposition Temperature 357 °C
675 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.000090 ohm-cm
<= 0.000090 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 2.0 ppm
2.0 ppm
Ionic Impurities - K (Potassium) 0.00 ppm
0.00 ppm
Ionic Impurities - Cl (Chloride) <= 10 ppm
<= 10 ppm
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 200 °C
0.500 hour

@Temperature 392 °F
minimum
Pot Life 20160 min
20160 min
Shelf Life 12.0 Month
12.0 Month
refrigerated upon arrival
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Ionic Impurities NH4 6 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 3.6
Weight Loss 0.19%
200°C
0.94%
250°C
1.7%
300°C
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