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Epoxy Technology EPO-TEK® ED1020 Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® ED1020 Epoxy.pdf
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  Online Service   lookpolymers   27660005
Material Notes:
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include long pot-life, low viscosity and high thixotropy making it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 2.89 g/cc
2.89 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 1479 cP

@Temperature 23.0 °C
1479 cP

@Temperature 73.4 °F
100 rpm
9569 cP

@Temperature 23.0 °C
9569 cP

@Temperature 73.4 °F
10 rpm
28583 cP

@Temperature 23.0 °C
28583 cP

@Temperature 73.4 °F
1 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 40
40
Tensile Modulus 0.24892 GPa
36.103 ksi
Storage
Thermal Properties Metric English Comments
CTE, linear 45.0 µm/m-°C
25.0 µin/in-°F
Below Tg
181 µm/m-°C
101 µin/in-°F
Above Tg
Thermal Conductivity 1.88 W/m-K
13.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C
302 °F
Continuous
250 °C
482 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 46.0 °C
>= 115 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 333 °C
631 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 0.00 ppm
0.00 ppm
Ionic Impurities - K (Potassium) 4.0 ppm
4.0 ppm
Ionic Impurities - Cl (Chloride) 169 ppm
169 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color Silver
Consistency Smooth thixotropic paste
Die Shear 15.4 kg
Initial
9.3 kg
After 1000hrs 85°C/85% RH
Ionic Impurities NH4 67 ppm
Number of Components Single
Thixotropic Index 3
Weight Loss 0.68%
200°C
1.24%
250°C
1.71%
300°C
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