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Epoxy Technology EPO-TEK® ED1020 Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® ED1020 Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include long pot-life, low viscosity and high thixotropy making it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	2.89 g/cc	2.89 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	1479 cP @Temperature 23.0 °C	1479 cP @Temperature 73.4 °F	100 rpm
	9569 cP @Temperature 23.0 °C	9569 cP @Temperature 73.4 °F	10 rpm
	28583 cP @Temperature 23.0 °C	28583 cP @Temperature 73.4 °F	1 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	40	40
Tensile Modulus	0.24892 GPa	36.103 ksi	Storage

Thermal Properties	Metric	English	Comments
CTE, linear	45.0 µm/m-°C	25.0 µin/in-°F	Below Tg
	181 µm/m-°C	101 µin/in-°F	Above Tg
Thermal Conductivity	1.88 W/m-K	13.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	150 °C	302 °F	Continuous
	250 °C	482 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 46.0 °C	>= 115 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	333 °C	631 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00040 ohm-cm	<= 0.00040 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	0.00 ppm	0.00 ppm
Ionic Impurities - K (Potassium)	4.0 ppm	4.0 ppm
Ionic Impurities - Cl (Chloride)	169 ppm	169 ppm

Processing Properties	Metric	English
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F
Pot Life	40320 min	40320 min
Shelf Life	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F

Descriptive Properties	Value	Comments
Color	Silver
Consistency	Smooth thixotropic paste
Die Shear	15.4 kg	Initial
	9.3 kg	After 1000hrs 85°C/85% RH
Ionic Impurities NH4	67 ppm
Number of Components	Single
Thixotropic Index	3
Weight Loss	0.68%	200°C
	1.24%	250°C
	1.71%	300°C

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