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Master Bond EP51HT Fast Curing High Temperature Resistant Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP51HT Fast Curing High Temperature Resistant Epoxy Adhesive.pdf
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Material Notes:
Master Bond Polymer Adhesive EP51HT represents a significant advance in epoxy adhesive technology featuring an excellent balance of performance properties, including convenient curing at ambient temperatures, and superior cost effective bonding performance for service from 4K to 400°F. This two component adhesive system is formulated to cure exceptionally fast (5 minute gels) at ambient temperatures or even more rapidly at elevated temperatures
Physical Properties Metric English Comments
Viscosity 60000 - 70000 cP

@Temperature 23.0 °C
60000 - 70000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 177 °C
350 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 240 - 360 min

@Temperature 23.0 °C
4.00 - 6.00 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Tan
Mix Ratio By Weight 100/100
Set-Up Time, minutes 5
At Room Temperature
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