Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. For opto-packaging, it can be used as the main gasket seal of glass plates in LCDs, or for sealing filter windows onto optosensors. A more thixotropic and viscous version of EPO-TEK® B9021.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.24 g/cc	1.24 g/cc
Particle Size	<= 20 µm	<= 20 µm
Viscosity	10000 - 15000 cP @Temperature 23.0 °C	10000 - 15000 cP @Temperature 73.4 °F	50 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	74	74
Tensile Modulus	1.40 GPa	203 ksi	Storage
Shear Strength	>= 9.38 MPa	>= 1360 psi	Die
	9.984 MPa	1448 psi	Lap

Thermal Properties	Metric	English	Comments
CTE, linear	97.0 µm/m-°C	53.9 µin/in-°F	Below Tg
	145 µm/m-°C	80.6 µin/in-°F	Above Tg
Maximum Service Temperature, Air	150 °C	302 °F	Continuous
	250 °C	482 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 50.0 °C	>= 122 °F
Decomposition Temperature	307 °C	585 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Dry Time	<= 24.0 hour	<= 24.0 hour
Cure Time	30.0 min @Temperature 75.0 °C	0.500 hour @Temperature 167 °F	minimum, B-stage
Pot Life	40320 min	40320 min
Shelf Life	12.0 Month	12.0 Month	refrigerated

Descriptive Properties	Value	Comments
Color	Cream	before cure
Consistency	Smooth Thixotropic paste
Number of Components	Single
Weight Loss	3.37%	200°C
	4.22%	250°C

Users viewing this material also viewed the following: