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Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® B9021-1 Epoxy Paste.pdf
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Material Notes:
Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. For opto-packaging, it can be used as the main gasket seal of glass plates in LCDs, or for sealing filter windows onto optosensors. A more thixotropic and viscous version of EPO-TEK® B9021.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.24 g/cc
1.24 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 10000 - 15000 cP

@Temperature 23.0 °C
10000 - 15000 cP

@Temperature 73.4 °F
50 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 74
74
Tensile Modulus 1.40 GPa
203 ksi
Storage
Shear Strength >= 9.38 MPa
>= 1360 psi
Die
9.984 MPa
1448 psi
Lap
Thermal Properties Metric English Comments
CTE, linear 97.0 µm/m-°C
53.9 µin/in-°F
Below Tg
145 µm/m-°C
80.6 µin/in-°F
Above Tg
Maximum Service Temperature, Air 150 °C
302 °F
Continuous
250 °C
482 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 50.0 °C
>= 122 °F
Decomposition Temperature 307 °C
585 °F
Degradation Temperature
Processing Properties Metric English Comments
Dry Time <= 24.0 hour
<= 24.0 hour
Cure Time 30.0 min

@Temperature 75.0 °C
0.500 hour

@Temperature 167 °F
minimum, B-stage
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month
12.0 Month
refrigerated
Descriptive Properties Value Comments
Color Cream
before cure
Consistency Smooth Thixotropic paste
Number of Components Single
Weight Loss 3.37%
200°C
4.22%
250°C
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