Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
Manufacturer | Devcon |
Trade Name | Plastic Steel® |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Devcon Plastic Steel® Liquid (B) Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 2.11 g/cc | 0.0763 lb/in³ | |
Viscosity | 15000 - 25000 cP | 15000 - 25000 cP | with hardener |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 85 | 85 | ASTM D2240 |
Tensile Strength, Ultimate | 33.8 MPa | 4900 psi | ASTM D638 |
Modulus of Elasticity | 5.86 GPa | 850 ksi | In Tension; ASTM D638 |
Flexural Yield Strength | 33.0 MPa | 4780 psi | ASTM D790 |
Compressive Yield Strength | 70.3 MPa | 10200 psi | ASTM D695 |
Adhesive Bond Strength | 19.3 MPa | 2800 psi | Adhesive tensile shear strength; ASTM D1002 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 68.0 µm/m-°C @Temperature 20.0 °C |
37.8 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Thermal Conductivity | 0.582 W/m-K | 4.03 BTU-in/hr-ft²-°F | ASTM C177 |
Maximum Service Temperature, Air | 121 °C | 250 °F | Operating Temperature |
Shrinkage | 0.060 % | 0.060 % | During Cure; ASTM D2566 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Dielectric Constant | 67.5 | 67.5 | ASTM D150 |
Dielectric Strength | 1.18 kV/mm | 30.0 kV/in | ASTM D149 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 21.1 °C | 70.0 °F | |
Pot Life | 45.0 min @Temperature 23.9 °C |
45.0 min @Temperature 75.0 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Coverage per lb. | 52 in² | at 1/4 inch thick |
Mix Ratio by Volume | 3 to 1 | resin:hardener |
Mix Ratio By Weight | 9 to 1 | resin:hardener |