Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
Manufacturer | Devcon |
Trade Name | |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Devcon High-Performance Backing Compound Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.61 g/cc | 0.0581 lb/in³ | |
Viscosity | 10320 cP | 10320 cP | with hardener |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 92 | 92 | ASTM D2240 |
Tensile Strength, Ultimate | 53.00 MPa | 7687 psi | ASTM D638 |
Modulus of Elasticity | 6.55 GPa | 950 ksi | In Tension; ASTM D638 |
Flexural Yield Strength | 79.3 MPa | 11500 psi | ASTM D790 |
Compressive Yield Strength | 130.0 MPa | 18850 psi | ASTM D695 |
Adhesive Bond Strength | 13.8 MPa | 2000 psi | Adhesive tensile shear strength; ASTM D1002 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 40.0 µm/m-°C @Temperature 20.0 °C |
22.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Maximum Service Temperature, Air | 121 °C | 250 °F | Operating Temperature |
Shrinkage | 0.060 % | 0.060 % | During Cure; ASTM D2566 |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Processing Temperature | 21.1 °C | 70.0 °F | |
Pot Life | 56.0 min @Temperature 23.9 °C |
56.0 min @Temperature 75.0 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Coverage per 20.3 lb. | 347 in² | |
Mix Ratio by Volume | 9.95 to 1 | resin:hardener |
Mix Ratio By Weight | 100 to 5.94 | resin:hardener |