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Devcon High-Performance Backing Compound Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Devcon
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Devcon High-Performance Backing Compound Epoxy.pdf
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Material Notes:
Abrasion-Resistant SystemData provided by Ellsworth Adhesives.
Physical Properties Metric English Comments
Density 1.61 g/cc
0.0581 lb/in³
Viscosity 10320 cP
10320 cP
with hardener
Mechanical Properties Metric English Comments
Hardness, Shore D 92
92
ASTM D2240
Tensile Strength, Ultimate 53.00 MPa
7687 psi
ASTM D638
Modulus of Elasticity 6.55 GPa
950 ksi
In Tension; ASTM D638
Flexural Yield Strength 79.3 MPa
11500 psi
ASTM D790
Compressive Yield Strength 130.0 MPa
18850 psi
ASTM D695
Adhesive Bond Strength 13.8 MPa
2000 psi
Adhesive tensile shear strength; ASTM D1002
Thermal Properties Metric English Comments
CTE, linear 40.0 µm/m-°C

@Temperature 20.0 °C
 22.2 µin/in-°F

@Temperature 68.0 °F
 ASTM D696
Maximum Service Temperature, Air 121 °C
250 °F
Operating Temperature
Shrinkage 0.060 %
0.060 %
During Cure; ASTM D2566
Processing Properties Metric English Comments
Processing Temperature 21.1 °C
70.0 °F
Pot Life 56.0 min

@Temperature 23.9 °C
 56.0 min

@Temperature 75.0 °F
Descriptive Properties Value Comments
Coverage per 20.3 lb. 347 in²
Mix Ratio by Volume 9.95 to 1
resin:hardener
Mix Ratio By Weight 100 to 5.94
resin:hardener
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