Cookson Group Plaskon® LS-16S Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® LS-16S Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress molding compound specifically formulated for use with conventional molding equipment to increase semiconductor manufacturing productivity and reduce production costs; recommended for molding of stress sensitive DIPs, SOICs, PLCCs & small QFPs Consistent, expedient moldability; Fast cycle times; Low viscosity; Minimal, if any, post mold cure; Low stress

Physical Properties	Metric	English	Comments
Density	1.85 g/cc	0.0668 lb/in³
Viscosity	7500 cP @Temperature 175 °C	7500 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	90.0 cm	35.4 in	175°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	80	80
Flexural Strength	117 MPa	17000 psi
Flexural Modulus	12.0 GPa	1740 ksi

Thermal Properties	Metric	English
CTE, linear	15.0 µm/m-°C @Temperature 20.0 °C	8.33 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	66.3 µm/m-°C @Temperature 20.0 °C	36.8 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	166 °C	331 °F
Flammability, UL94	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in
	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in

Electrical Properties	Metric	English
Electrical Resistivity	9.50e+15 ohm-cm	9.50e+15 ohm-cm
Dielectric Constant	3.3 @Frequency 1000 Hz	3.3 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0030 @Frequency 1000 Hz	0.0030 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Processing Properties	Metric	English	Comments
Processing Temperature	175 °C	347 °F	Molding temperature

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