Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound (discontinued **)

Category	Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound (discontinued **).pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound specifically formulated for packaging stress-sensitive devices in DIPs, SOICs, PLCCs and small QFPs. Features: no post mold cure, high productivity, JEDEC level 1 for SOICs and SSOPs Thermal properties given As Molded

Physical Properties	Metric	English	Comments
Density	1.92 g/cc	0.0694 lb/in³
Viscosity	7500 cP @Temperature 175 °C	7500 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	76.0 cm	29.9 in	175°C/1000 psi

Mechanical Properties	Metric	English
Hardness, Shore D	76	76
Flexural Strength	132 MPa	19100 psi
Flexural Modulus	17.0 GPa	2470 ksi

Thermal Properties	Metric	English
CTE, linear	14.0 µm/m-°C @Temperature 20.0 °C	7.78 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	63.0 µm/m-°C @Temperature 20.0 °C	35.0 µin/in-°F @Temperature 68.0 °F
Glass Transition Temp, Tg	147 °C	297 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Electrical Properties	Metric	English
Electrical Resistivity	3.50e+15 ohm-cm	3.50e+15 ohm-cm
Dielectric Constant	3.55 @Frequency 1000 Hz	3.55 @Frequency 1000 Hz
Dielectric Strength	31.0 kV/mm	787 kV/in
Dissipation Factor	0.0023 @Frequency 1000 Hz	0.0023 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Processing Temperature	175 °C	347 °F	Molding temperature

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