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Atom Adhesives AA-BOND FDA22 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-BOND FDA22 Epoxy Adhesive.pdf
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Material Notes:
AA-BOND FDA22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300. AA-BOND FDA22 is two-parts tan adhesive is easily mixed, used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices. AA-BOND FDA22 is an effective electrical insulator, and it provides low permeability to gases and vapors, and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and inorganic compounds.Appearance: Light Tan Cure Type: Heat cure or Room TemperatureBenefits:High viscosityElectrical insulatorLow permeabilityGood resistanceEasily mixed Mix Ratio by weight: 100:40/Resin:HardenerSubstrates: Most metals, ceramic, glass and plastics Typical Application: Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.Information provided by Atom Adhesives
Physical Properties Metric English Comments
Specific Gravity 1.44 g/cc
1.44 g/cc
uncured
Viscosity 27000 cP
27000 cP
uncured
Mechanical Properties Metric English Comments
Hardness, Shore D 78
78
cured
Elongation at Yield 5.0 %
5.0 %
cured
Adhesive Bond Strength 14.5 MPa
2100 psi
Lap shear, alum to alum
Thermal Properties Metric English Comments
CTE, linear 47.0 µm/m-°C
26.1 µin/in-°F
Maximum Service Temperature, Air 145 °C
293 °F
Minimum Service Temperature, Air -70.0 °C
-94.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 1.50e+14 ohm-cm
1.50e+14 ohm-cm
Dielectric Constant 3.5

@Frequency 1000 Hz
3.5

@Frequency 1000 Hz
Dielectric Strength 16.5 kV/mm
420 kV/in
Dissipation Factor 0.020

@Frequency 1000 Hz
0.020

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 60.0 - 240 min

@Temperature 65.0 °C
1.00 - 4.00 hour

@Temperature 149 °F
1440 - 2160 min

@Temperature 25.0 °C
24.0 - 36.0 hour

@Temperature 77.0 °F
Descriptive Properties Value Comments
Thixotropic Index 1.2
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