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- AIM 54Sn/26Pb/20In Solder for Photonic Packaging
AIM 54Sn/26Pb/20In Solder for Photonic Packaging
| Category | Metal , Nonferrous Metal , Solder/Braze Alloy , Tin Alloy |
| Manufacturer | AIM Specialty Materials |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | AIM 54Sn/26Pb/20In Solder for Photonic Packaging.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 8.10 g/cc | 0.293 lb/in³ |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
|
| Melting Point | 138 - 170 °C | 280 - 338 °F | |
| Solidus | 138 °C | 280 °F | |
| Liquidus | 170 °C | 338 °F |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Indium, In | 20 % | 20 % | |
| Lead, Pb | 26 % | 26 % | |
| Tin, Sn | 54 % | 54 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Creep Resistance | Moderate |
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