Electrical Properties | Metric | English | Comments |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | |
Premix Thermoplastics PRESEAL 6080 Ag-Coated Glass Highly conductive PRESEAL® thermoplastic elastomer compounds are injection-mouldable and extrudable plastics for EMI-gasket and -housing applications, among other uses. The material is an ideal cho.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | |
Premix Thermoplastics PRESEAL 6080 Ag-Coated Glass Metal replacement is one of the fastest growing areas for conductive plastics. Plastics, with their lighter weight, good processability and optimal combination of mechanical properties have challeng.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | ASTM D257 |
Premix Thermoplastics PRESEAL® TPE 6080 General Description:PRESEAL® TPE 6080 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasket applications. It can also be used as conductors or in grounding.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | |
P & P Technology Silver/Aluminum Conductive Adhesive P & P Technology conductive silver/aluminum adhesive is a one part electrically conductive room temperature curing elastomer. It is supplied as a readily extrudable paste that cures rapidly when exp.. |
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Volume Resistivity | <= 0.010 ohm-cm @Temperature 100 °C, Time 2700 sec |
<= 0.010 ohm-cm @Temperature 212 °F, Time 0.750 hour |
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Parker Chomerics CHO-BOND 360-208 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E.. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | |
Parker Chomerics CHO-BOND® 1121 General Purpose Adhesive-Sealant Silver Silicone Description: Xylene-free version of CHO-BOND 1038; rec. bond line thickness: > 0.18 mm; primer promotes adhesion CHO-BOND® 1121 is an electrically conductive, one-component silicone adhesive-sealan.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | Post Tensile Set; MIL-DTL-83528 Para.4.6.9 |
Parker Chomerics CHO-SEAL 1212 Conductive Elastomer High strength, hard (80 shore A) material for waveguide, choke, cover, and flanges with grooves for EMI and pressure sealing.Molded onlyRoHS Compliant Information provided by Chomerics |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | Post Tensile Set; MIL-DTL-83528 Para.4.6.9 |
Parker Chomerics CHO-SEAL 1224 Conductive Elastomer Highest shielding effectiveness and through conductivity performance; higher physical properties; excellent processing; also available in a fabric reinforced format.Molded onlyRoHS CompliantInformat.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | as supplied without pressure sensitive adhesive; MIL-DTL-83528 |
Parker Chomerics CHO-SEAL 1350 Conductive Elastomer Standard material for high volume injection and compression molding and small extrusions; high performance in non-corrosive environments; used in grounding applications with little or no vibration.R.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | as supplied without pressure sensitive adhesive; MIL-DTL-83528 |
Parker Chomerics CHO-SEAL 1401 Conductive Elastomer High performance for non-corrosive environments; soft(45 Shore A) for low closure force where gasket geometry cannot be exploited; low tear strength; no fluid resistance. Molded and ExtrudedRoHS Com.. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | |
Parker Chomerics Tecknit® 0035 Conductive Silicone Sealant/Adhesive Comments: Thin flexible pasteTypical Applications: Bonding elastomer gasketInformation provided by Chomerics |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | Cured; QA-1038 |
Parker Chomerics Tecknit® 72-00151 Silver-Filled Flexible Resin Caulking System Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide .. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | Cured; QA-1038 |
Parker Chomerics Tecknit® 72-00152 Silver-Filled Flexible Resin Caulking System Description: TECKNIT standard electrically conductive caulks consist of four one-component resin systems filled with silver plated glass or copper particles. These systems are formulated to provide .. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | Cured; QA-1038 |
Parker Chomerics Tecknit CON/RTV-I One Part: Silver-Filled Silicone RTV Description: TECKNIT CON/RTV-I system is a pure silver loaded, one component RTV silicone adhesive sealant. It is ready to use without mixing and cures quickly at room temperature on exposure to moi.. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | |
Parker Chomerics Tecknit Consil®-II 841 Molded Silver-Filled Silicone Elastomer Description: CONSIL-II is a molded silicone elastomer filled with silver-coated inert particles. It provides high electrical conductivity, broadband shielding and moisture sealing. CONSIL-II is desi.. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | |
Parker Chomerics Tecknit Consil®-II 842 Molded Silver-Filled Silicone Elastomer Description: CONSIL-II is a molded silicone elastomer filled with silver-coated inert particles. It provides high electrical conductivity, broadband shielding and moisture sealing. CONSIL-II is desi.. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | Cured; QAP-1017 |
Parker Chomerics Tecknit TeckBond™-A Silver-Plated Aluminum-Filled Adhesive Description: TECKBOND-A conductive system is a silicone based, two-component RTV, filled with silver-plated aluminum particles. After cure, the resultant bond or seal is flexible, resilient, and con.. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | |
Parker Chomerics Tecknit Teckfip™ FIP-A Formed in Place Conductive Elastomer Description: This compound is ideally suited to corrosion-concerned applications where the gasket is applied to an aluminum casting. The corrosion resistance is enhanced due to the galvanic compatib.. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | |
Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommu.. |
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Volume Resistivity | 0.010 - 1.0 ohm-cm | 0.010 - 1.0 ohm-cm | IEC 60093 |
Teijin Panlite® B-8130R Carbon Fiber Reinforced Polycarbonate Resin CF 30% reinforced grade, meeting UL 94 V-2. It has excellent strength, stiffness, heat resistance and electric conductivity. Other features are low molding shrinkage and dimensional accuracy.Applica.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | Absolute Drying; ASTM-D257 |
Toyobo GLAMIDE® T-665C30 Nylon-66 GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | cured 1 hr @ 65°C |
Tra-Con Tra-Duct 916H02 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H02 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | cured 72 hrs @ 25°C |
Tra-Con Tra-Duct 916H02 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H02 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | cured 24 hrs @ 25°C |
Tra-Con Tra-Duct 916H03 Room Temperature Cure High Conductivity Silver Epoxy Adhesive TRA-DUCT 916H03 is recommended for electronic bonding and sealing applications that require the combination of high conductivity coupled with good mechanical properties. This two part smooth paste s.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | in plane |
Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material Bulk Molding Compounds, Inc. is the largest manufacturer of thermoset bulk molding compounds in North America, serving the automotive, appliance, and electrical markets. BMC thermosets are the most .. |
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Volume Resistivity | <= 0.010 ohm-cm | <= 0.010 ohm-cm | |
Parker Chomerics CHO-BOND 1038 Conductive Silicone RTV Adhesive Electrically conductive, one component silicone adhesive/sealant that may be used for bonding EMI gaskets or for providing EMI and environmental protection as a caulk. This material cures on exposur.. |
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Volume Resistivity | 0.010 ohm-cm | 0.010 ohm-cm | as supplied without pressure sensitive adhesive; MIL-DTL-83528 |
Parker Chomerics CHO-SEAL 1217 Conductive Elastomer Resists highest level of EMP induced current; military gasket of choice in non-corrosive environments; excellent processing for molding and extrusion. Molded and ExtrudedRoHS Compliant Information p.. |