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Polymer Property : Hot Wire Ignition, HWI = 120 sec Product List
Electrical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 3.00 mm |
60 - 120 sec @Thickness 0.118 in |
UL 746 |
| Polymer Resources PC/ABS-FR1 Flame Retardant PC/ABS Alloy PC/ABS Alloy, Flame Retardant, Standard FlowProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.Information provided.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 3.00 mm |
60 - 120 sec @Thickness 0.118 in |
UL 746 |
| Polymer Resources PC-FR2A-D Polycarbonate, Flame Retardant, Medium Flow Polycarbonate, Flame Retardant, Medium FlowFeatures: • High Impact Resistance • Self ExtinguishingProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-i.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 3.00 mm |
60 - 120 sec @Thickness 0.118 in |
UL 746 |
| Polymer Resources PC-GP1-D Polycarbonate, General Purpose, Low Flow Polycarbonate, General Purpose, Low FlowFeatures: • Ultra High Impact Resistance • Self ExtinguishingProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 3.00 mm |
60 - 120 sec @Thickness 0.118 in |
UL 746 |
| Polymer Resources PC-GP1-D-[color]-1 Polycarbonate, General Purpose, Low Flow with Mold Release Polycarbonate, General Purpose, Low Flow with Mold ReleaseProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.Inform.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 3.00 mm |
60 - 120 sec @Thickness 0.118 in |
UL 746 |
| Polymer Resources PC-GP3-D Polycarbonate, General Purpose, High Flow Polycarbonate, General Purpose, High FlowFeatures: • High Impact Resistance • Self ExtinguishingProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inc.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 1.70 mm |
60 - 120 sec @Thickness 0.0669 in |
UL 746 |
| Polymer Resources PC-GP4 Polycarbonate, General Purpose, Easy Flow Polycarbonate, General Purpose, Easy FlowFeatures: • High Impact Resistance • Self Extinguishing • High FlowProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conduc.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 1.70 mm |
60 - 120 sec @Thickness 0.0669 in |
UL 746 |
| Polymer Resources PC-GP4-[color]-1 Polycarbonate, General Purpose, Easy Flow with Mold Release Polycarbonate, General Purpose, Easy Flow with Mold ReleaseProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.Infor.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 3.00 mm |
60 - 120 sec @Thickness 0.118 in |
UL 746 |
| Polymer Resources PC-HM-FR1 Polycarbonate, 10% Glass Reinforced, Flame Retardant Polycarbonate, 10% Glass Reinforced, Flame RetardantProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.Information .. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 3.00 mm |
60 - 120 sec @Thickness 0.118 in |
UL 746 |
| Polymer Resources TP-G30 Polybutylene Terephthalate, 30% Glass Reinforced Polybutylene Terephthalate, 30% Glass ReinforcedProcess: Injection MoldingNotes: All physical, mechanical and thermal testing conducted on 1/8-inch thick, un-pigmented, test samples.Information prov.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 1.50 mm |
60 - 120 sec @Thickness 0.0591 in |
(ALL) |
| Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 1.50 mm |
60 - 120 sec @Thickness 0.0591 in |
(BK, BN) |
| Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, .. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 0.840 mm |
60 - 120 sec @Thickness 0.0331 in |
BK |
| Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 1.50 mm |
60 - 120 sec @Thickness 0.0591 in |
(BN, BK) |
| Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical AF312T ABS, Flame Retardant Feature: Injection Molding, Flame RetardantApplication: Electric/Electronic Applications (TV, Monitor Housing) IT/OA deviceCAS No. 9003-56-9, 79-94-7 and 1309-64-4Information provided by LG Chemical.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical AF342 ABS, Flame Retardant Feature: Injection Molding, Flame RetardantApplication: Electric/Electronic Applications (TV, Monitor Housing) IT/OA deviceCAS No. 9003-56-9, 40039-93-8 and 1309-64-4Information provided by LG Chemi.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical AF342T ABS, Flame Retardant, High Impact Feature: Injection Molding, Flame Retardant, High ImpactApplication: Electric/Electronic Applications (TV, Monitor Housing) IT/OA deviceCAS No. 9003-56-9, 40039-93-8 and 1309-64-4Information provide.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical KEYFLEX BT 1140D Ester Type TPE Description: Injection Molding, TPC-ET, General Purpose, Medium ModulusApplication: Cable & Wire Jackets, Hose & Tubing, SheetCAS: 37282-12-5Information provided by LG Chemical |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical Lupox® GP2300R PBT+GF30% Description: Injection Molding, PBT+GF30%, Anti-HydrolysisApplication: E&E (Speed Nut & Body)CAS No. 65997-17-3 and 24968-12-5Information provided by LG Chemical |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical Lupox® TE5006F PET+PC Description: Injection Molding, PET+PC, Flame Retardant, GWIT, CTIApplication: IT/OA, E&E (Connector)CAS No. 68928-70-1, 103598-77-2, 25038-59-9 and 1309-64-4Information provided by LG Chemical |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical Lupoy 1301EP-22 Polycarbonate Resin Description: LUPOY PC 1301EP-22 resin is designed for extrusion and injection molding products. It exhibits an excellent physical property balance of heat resistance, transparency and impact strengt.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical Lupoy 1301EP30 Polycarbonate Resin Description: LUPOY PC 1301EP-30 resin is designed for extrusion and injection molding products. It exhibits an excellent physical property balance of heat resistance, transparency and impact strengt.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical LUPOY GP1000HU PC, Transparent Description: Injection Molding, PC, General Purpose, Transparency, UV StabilityApplication: Electric & Electronic (Housing, Components) For Suit caseCAS: 103598-77-2Information provided by LG Chemic.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical Lupoy 1200HP-15 Polycarbonate Resin Description: LUPOY PC 1200HP-15 resin is designed for extrusion and injection molding products. It exhibits an excellent physical property balance of heat resistance, transparency and impact strengt.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical Lupoy 1201HP-08 Polycarbonate Resin Description: LUPOY PC 1201HP-08 resin is designed for extrusion and injection molding products. It exhibits an excellent physical property balance of heat resistance, transparency and impact strengt.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical LUPOY GP1000M PC, Transparent Description: Injection Molding, PC, General Purpose, TransparencyApplication: IT/OA, Electric & Electronic Housing and Components, Automotive Exterior and InteriorCAS: 103598-77-2Information provide.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical LUPOY GP1000MR PC, Transparent Description: Injection Molding, PC, General Purpose, Transparency, Mold ReleaseApplication: IT/OA Housing and Components, Automotive InteriorCAS: 103598-77-2Information provided by LG Chemical |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical LUPOY GP1000MU PC, Transparent Description: Injection Molding, PC, General Purpose, Transparency, UV StabilityApplication: IT/OA Housing and Components, Automotive Exterior and InteriorCAS: 103598-77-2Information provided by LG C.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical LUPOY GP1000SW PC, Transparent Description: Injection Molding, PC, General Purpose, TransparencyApplication: Keypad for Mobile Phone, Automotive (Interior)CAS: 103598-77-2Information provided by LG Chemical |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness 0.750 mm |
60 - 120 sec @Thickness 0.0295 in |
BK |
| Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,.. |
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| Hot Wire Ignition, HWI | 60 - 120 sec @Thickness >=3.00 mm |
60 - 120 sec @Thickness >=0.118 in |
|
| LG Chemical LUPOY GP1000ML PC, Transparent Description: Injection Molding, PC, General Purpose, TransparencyApplication: IT/OA Housing and Components, Automotive InteriorCAS: 103598-77-2Information provided by LG Chemical |
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