Polymer Property : Cure Time = 0.333 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Buna N Rubber, handling time
Permabond 731 Cyanoacrylate, toughened PERMABOND® 731 is a toughened cyanoacrylate with very good impact and peel strength when compared to a conventional cyanoacrylate. It bonds rapidly at room temperature and its viscosity is stable o..
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Phenolic, handling time
Permabond 240 Cyanoacrylate, gap filling PERMABOND® 240 is a high viscosity product useful in large gap applications. It is ideal for porous substrates. It is fast setting and suitable for use on plastics, rubber and metals. Cyanoacrylate..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Phenolic, set time
Permabond 931 Cyanoacrylate PERMABOND 931 is a low odor, nonfogging, nonfrosting cyanoacrylate. The reduced odor improves worker comfort. Unsightly fogging adjacent to bondlines, common with other cyanoacrylate adhesiv..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 13 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically mica filled, heat resistance, good electrical properties, UL listed molding compound 0.75 mm/V-1 (NC), 3 mm/V-0, standardized molding compound.Application ar..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties (discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive (discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage (discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 38110 Phenolic Formaldehyde Resin, High Surface Quality (discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Devices for the electrical installation, pan handles, knobs, mainly for compression molding.Information provided by Bak AGBak ..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ 460124 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Cookware fittings, electric devices.Information provided by Bak AGBak AG became a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X30 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, reinforced with cotton and sisal fibers, increased notched impact strength.Application areas: Covers for electrical and electromagnetic devices.Information provided by Bak..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Cure Time	0.0833 - 0.333 min	0.00139 - 0.00556 hour	Plastic set time
Lord Adhesives 9010 Medium Viscosity, Odorless, Non-Frosting Methoxyethyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLordÂ® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6150 BK Melt Processable Elastomer DuraGrip™ 6150BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6150BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6160 BK Melt Processable Elastomer DuraGrip™ 6160BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6160BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ 6170 BK Melt Processable Elastomer DuraGrip™ 6170BK is designed to be a special purpose Melt Processable Elastomer (MPE) that is easy to use in injection molding and extrusion processes. DGR 6170BK has an excellent soft touch feel a..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6030 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6030 NC/BK are designed to be general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6030 NC/BK have an excellent soft t..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6070 NC Thermoplastic Elastomer (TPE) DuraGrip® DGR 6070NC is designed to be a general purpose Thermoplastic Elastomer (TPE) that is easy to use in injection molding and extrusion processes. DGR 6070NC has an excellent soft touch feel,..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Cooling Time
Advanced Polymer Alloys DuraGrip™ DGR 6080 NC/BK Thermoplastic Elastomer (TPE) DuraGrip® DGR 6080NC/BK are designed to be a general purpose Thermoplastic Elastomers (TPE) that are easy to use in injection molding and extrusion processes. DGR 6080NC/BK have excellent soft touc..
Cure Time	0.0833 - 0.333 min	0.00139 - 0.00555 hour	Time to Handling Strength
3M Scotch-Weld™ MC100 Metal Instant Adhesive 3M™ Scotch-Weld™ Metal Instant Adhesives are designed to give optimum performance and high strength bonds on metals, including galvanized or anodized surfaces. MC100 (formerly SB30 or SB96) is a l..
Cure Time	0.250 - 0.333 min	0.00417 - 0.00556 hour	Fixture Rate
Dymax Magnet Bonder™ 2000 Adhesive DYMAX® Magnet Bonder™ Adhesives for Higher Performance and Lower CostDymax 2000 Magnet Bonder™ AdhesiveFastest cure; bond ferrite to steel. Typical Use: Loudspeaker magnet to pole piece.
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive (di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
Cure Time	0.167 - 0.333 min	0.00278 - 0.00556 hour	Per 1 mm of wall thickness, injection molding
Hexion Bakelite™ PF 2855 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage, For Electrostatic Coating, Dishwasher Proof, UL Listed Phenolic molding compound, inorganically/organically filled, heat resistant up to 250°C, hot steam and hot water resistant, high surface quality, for electrostatic coating, UL listed molding compou..