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- Polymer Property : Cure Time = 30.0 min
Polymer Property : Cure Time = 30.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 140 °C |
0.500 hour @Temperature 284 °F |
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| Parker Chomerics CHO-FORM® 5515 Robotically Dispensed Gasketing Description: CHO-FORM® 5515 One-component, thermal cure silicone system, with Ni/Graphite filler. Minimum cure temperature is 100°C (212°F). A low-cost solution for EMI shielding, it is specially.. |
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| Cure Time | 30.0 - 60.0 min | 0.500 - 1.00 hour | working strength |
| Permabond TA435 Toughened Acrylic Adhesive & Initiator PERMABOND TA435 is a structural acrylic adhesive designed primarily for bonding metals, ferrites, ceramics and some thermoplastics. This adhesive may be used in a variety of structural bonding appli.. |
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| Cure Time | 30.0 min @Temperature -65.0 - 450 °C |
0.500 hour @Temperature -85.0 - 842 °F |
Handling |
| Palm Labs Adhesives TURBO-LOCK SERIES 17-HT Anaerobic Thread Locking Compound BEARING AND SHAFT - SERIES 17-HT is a fast curing, GREEN, high temperature, high strength, high viscosity, press fit, anaerobic retaining compound for bonding, sealing and retaining of cylindrical p.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
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| Parker Chomerics CHO-BOND 1085 Conductive Adhesive CHO-BOND® adhesives are electrically conductive epoxy and silicone resins. Curing mechanisms are either room temperature, elevated temperature or moisture. Both single and two-component systems are.. |
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| Cure Time | 30.0 min @Temperature 170 °C |
0.500 hour @Temperature 338 °F |
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| Humiseal 1A20LSE Urethane Conformal Coating Humiseal 1A20LSE Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableUL Approval PendingMIL-I-46058C Approval pendingPasses ther.. |
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| Cure Time | 30.0 min @Temperature 170 °C |
0.500 hour @Temperature 338 °F |
|
| Humiseal 1B12 Acrylic Conformal Coating Humiseal 1B12 Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityPasses thermal shock test (MIL-I-46058C)Flammabili.. |
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| Cure Time | 30.0 min | 0.500 hour | Dry Time to Handling; Fed Std 141 4061 |
| Humiseal 1B73 Acrylic Conformal Coating Humiseal 1B73 Acrylic Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesSelective chemical resistanceExcellent repairabilityUL ApprovedMIL-I-46058C ApprovedPasses thermal sho.. |
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| Cure Time | 30.0 min @Temperature 210 °C |
0.500 hour @Temperature 410 °F |
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| Lord Adhesives 8601 Polymer Resistor Composition LORD 8600 series polymer resistor compositions are designed for screen print application onto a wide range of substrates.All information provided by Lord. |
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| Cure Time | 30.0 min @Temperature 210 °C |
0.500 hour @Temperature 410 °F |
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| Lord Adhesives 8631 Polymer Resistor Composition LORD 8600 series polymer resistor compositions are designed for screen print application onto a wide range of substrates.All information provided by Lord. |
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| Cure Time | 30.0 - 40.0 min | 0.500 - 0.667 hour | Working time |
| ITW Devcon Safety Clear Coatâ„¢ Epoxy, Water Clear Information provided by ITW Devcon |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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| Lord Adhesives CircuitSAFâ„¢ ME-456 Epoxy Dam Encapsulant CircuitSAFâ„¢ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a .. |
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| Cure Time | 30.0 - 45.0 min | 0.500 - 0.750 hour | Tack-free |
| Sika Industry SikaFlex 252 One Part Polyurethane Adhesive Sika 252 SikaFlex One Part Polyurethane AdhesiveA high viscous, high strength adhesive, this product can replace rivets, screws, welds, and other mechanical fasteners. Seals and bonds in one step. 4.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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| Tra-Con Tra-Bond 221M02 Information provided by Tra-Con Inc. |
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| Cure Time | 30.0 min @Temperature 152 °C |
0.500 hour @Temperature 305 °F |
|
| TSE Industries Millathane® 5004 Millable Polyurethane Elastomer with 60 PHR N330 (HAF) Black MILLATHANE 5004 is a millable polyurethane elastomer having excellent processing characteristics. MILLATHANE 5004 stocks can be readily processed on conventional rubber equipment. Vulcanization is c.. |
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| Cure Time | 30.0 - 60.0 min | 0.500 - 1.00 hour | |
| Trelleborg Emerson & Cuming Stycast® 2057FR/11 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc.. |
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| Cure Time | 30.0 min @Temperature 75.0 °C |
0.500 hour @Temperature 167 °F |
minimum, Pre-cure |
| Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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| Cure Time | 30.0 min @Temperature 180 °C |
0.500 hour @Temperature 356 °F |
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| Dow BETAMATE™ 5103-2 Epoxy BETAMATE™ 5103-2 is a one component heat curing Epoxy paste adhesive. The material is readily pumped at ambient temperatures. It shows excellent adhesion to automotive steel, including coated ste.. |
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| Cure Time | 30.0 min @Temperature 180 °C |
0.500 hour @Temperature 356 °F |
|
| Dow BETAMATE™ XW 1044-3 Epoxy BETAMATE™ XW 1044-3 is a one component, epoxy based adhesive especially developed for the body shop. The adhesive can be applied by robot systems and it shows high adhesion to metal and non-metal .. |
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| Cure Time | 30.0 min | 0.500 hour | Tack-Free, 10 g, 1/4" thick @ RT |
| 3M Scotch-Weld™ DP-5106 Control Joint Sealant 3M™ Scotch-Weld™ Control Joint Sealant DP-5106 is a self-leveling, gray, rapid setting, two-component polyurethane. It is packaged as 1:1 ratio liquids in duo-pak cartridges. With the squeeze of t.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
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| Parker Chomerics CHO-SHIELD® 1086 Silicone Adhesive Primer Air-drying liquid coatings used to improve the adhesion of Chomerics CHO-BOND conductive silicone elastomers to metal and other non-silicone substrates. The primers are moisture reactive and clear i.. |
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| Cure Time | 30.0 - 240 min | 0.500 - 4.00 hour | Full Cure; Primed |
| Loctite® Gasket Eliminator® 504 Flange Sealant Anaerobic GasketingLoctite® 504 Gap Filling Rigid Cure Gasket Eliminator® Flange SealantA single-component, instant low pressure seal that fills gaps to 0.030". Typical Use: Gap filling |
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