Parker Chomerics CHO-FORM® 5515 Robotically Dispensed Gasketing

Category	Polymer , Thermoset , Silicone
Manufacturer	Parker Chomerics
Trade Name	CHO-FORM®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-FORM® 5515 Robotically Dispensed Gasketing.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Description: CHO-FORM® 5515 One-component, thermal cure silicone system, with Ni/Graphite filler. Minimum cure temperature is 100°C (212°F). A low-cost solution for EMI shielding, it is specially formulated to reduce galvanic activity between the housing and EMI gasket, and for use on outdoor applications requiring long-term corrosion resistance.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	1.80 g/cc	1.80 g/cc	ASTM D792

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	50 - 75	50 - 75	ASTM D2240
Tensile Strength	>= 3.10 MPa	>= 450 psi	ASTM D412
Elongation at Break	>= 100 %	>= 100 %	ASTM D412
Compression Set	<= 25 % @Temperature 85.0 °C, Time 79200 sec	<= 25 % @Temperature 185 °F, Time 22.0 hour	ASTM D395 Method B

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	100 °C	212 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.20 ohm-cm	<= 0.20 ohm-cm	Initial; MIL-G-83528 Para. 4.6.11
	<= 0.30 ohm-cm	<= 0.30 ohm-cm	Aged; MIL-G-83528 Para. 4.6.15
Shielding Effectiveness	75 - 85 dB	75 - 85 dB	modified specimen 0.85 mm x 1.0 mm bead with plastic bolts; MIL-G-83528 Para. 4.6.12

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 140 °C	0.500 hour @Temperature 284 °F

Descriptive Properties	Value	Comments
Adhesion	>8 N/cm²	WI 038
Cure System	Heat
Filler	Ni/Graphite
Mix Ratio	1-part

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