Parker Chomerics CHO-BOND 1085 Conductive Adhesive

Category	Polymer , Adhesive , Thermoset
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 1085 Conductive Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

CHO-BOND® adhesives are electrically conductive epoxy and silicone resins. Curing mechanisms are either room temperature, elevated temperature or moisture. Both single and two-component systems are available, depending on the resin system selected.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	0.720 - 1.02 g/cc	0.720 - 1.02 g/cc
Thickness	<= 5.08 microns	<= 0.200 mil

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	200 °C	392 °F
Minimum Service Temperature, Air	-80.0 °C	-112 °F

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F
Shelf Life	6.00 Month	6.00 Month

Descriptive Properties	Value	Comments
Binder	Primer
Consistency	Thin Fluid
Filler	Primer
Mix Ratio	1-part

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