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Polymer Property : Cure Time = 1.50 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 90.0 min @Temperature 82.2 °C |
1.50 hour @Temperature 180 °F |
De-mold Time |
| Northstar Polymers MSN-V40A Polyester Base Low-Rebound Impact/Vibration Dampening Gel This polyurethane casting material is developed for applications that require Shore OO 40 range casting material with vibration dampening property and higher strength than standard polyurethane gel .. |
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| Cure Time | 90.0 min @Temperature 150 °C |
1.50 hour @Temperature 302 °F |
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| Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 777-1FR Film Adhesive Flame retardant, nonmetallic modified epoxy film adhesiveApplications: Metal and Honeycomb Bonding |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 795SF Composite Surfacing Film Modified epoxy film specifically formulated to improve the surface appearance of composite honeycomb structures. Excellent surface appearance; reduced pinholing, extra finishing. Superior out-time. .. |
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| Cure Time | 90.0 - 120 min @Temperature 149 °C |
1.50 - 2.00 hour @Temperature 300 °F |
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| Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
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| Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f.. |
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| Cure Time | 90.0 min @Temperature 125 °C |
1.50 hour @Temperature 257 °F |
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| Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 890 Course Grade Sliding Wear Compound An advanced ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at the thickness of 6 mm (1/4”).. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC 897 Fine Grade Sliding Wear Compound Description: ARC 897 is an advanced ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a t.. |
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| Cure Time | 90.0 min @Temperature 32.0 °C |
1.50 hour @Temperature 89.6 °F |
Foot Traffic |
| Chesterton ARC 988 Composite Description: A high performance, quartz reinforced composite designed to resurface and restore concrete surfaces, to protect new concrete, and to repair concrete damaged by severe chemical and physi.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC BX1 Sliding Wear Compound Description: An advanced contractor grade ceramic composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is normally applied at.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC BX2 Contractor Grade Fine Sliding Wear Compound Description: ARC BX2 is an advanced contractor grade ceramic reinforced composite for the repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It .. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton ARC I BX1 Impact & Wear Resistant Epoxy Composite Description: An advanced grade epoxy and urethane composite for the repair and protection of all metal surfaces subjected to severe abrasion and impact. It is normally applied at a thickness of 6 mm.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE SYSTEM Vinyl Ester Lining Description: ARC NVE is a high performance, quartz reinforced, three-component, modified novolac vinyl ester lining capable of being applied to horizontal and vertical surfaces. The NVE system kit i.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Cure Time | 90.0 min @Temperature 25.0 °C |
1.50 hour @Temperature 77.0 °F |
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| ACC QGel 311 QSI Quantum Silicones General Purpose Silicone Gel QGel 311 is a clear, fast cure, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
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| Cure Time | 90.0 min @Temperature 80.0 °C |
1.50 hour @Temperature 176 °F |
|
| Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |
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| Cure Time | 90.0 min @Temperature 180 °C |
1.50 hour @Temperature 356 °F |
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| Atom Adhesives AA-DUCT AD1 Epoxy Adhesive AA-DUCT AD1 is a single component epoxy, formulated with pure silver power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive .. |
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| Cure Time | 90.0 min @Temperature 180 °C |
1.50 hour @Temperature 356 °F |
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| Atom Adhesives AA-DUCT CG2 Epoxy Adhesive AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulati.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol MA 562 Core Splice Adhesive General-purpose 250°F / 121°C or 350°F / 177°C curing foaming adhesive. Designed for service temperatures from -67°F / -55°C to 350°F / 177°C. Medium tack, nonmetallic, low exotherm properti.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Foot Traffic |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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| Cure Time | 90.0 min @Temperature 21.0 °C |
1.50 hour @Temperature 69.8 °F |
Light Load |
| Chesterton ARC NVE VC Vinyl Ester Sealer Description: ARC NVE VC (Veil Coat) is a two-component, modified epoxy novolac vinyl ester sealer coat formulated for application by brush, roller or spray at 0.15-0.25 mm (0.07-0.010”) wet film th.. |
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| Cure Time | 90.0 min @Temperature 43.0 °C |
1.50 hour @Temperature 109 °F |
Light Load |
| Chesterton MRS 58 Metal Rebuilding System An advanced ceramic composite for the repair and protection of all metal surfaces subjected to erosion, corrosion and chemical attack. It is normally applied at a thickness of 1.5 mm (60 mils) or mo.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol EA 9820 Paste Adhesive System High-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting a.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol EA 9825 Paste Adhesive System Low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F / 177°C. Ideal for fastener or attachment potting an.. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
|
| Henkel Hysol MA 562SFR Core Splice Adhesive Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Flame-retardant, nonmetallic, medium tack, excellent slump resistance. |
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| Cure Time | 90.0 min @Temperature 121 °C |
1.50 hour @Temperature 250 °F |
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| Henkel Hysol PL 460 Core Splice Adhesive Foaming epoxy adhesive in paste form for easy extrusion through packaged cartridges. Expands and cures at temperatures from 250°F / 121°C to 350°F / 177°C. Qualified to Boeing BMS 5-90, Type IV... |
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