Polymer Property : Cure Time = 120 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	60.0 - 120 min @Temperature 65.0 °C	1.00 - 2.00 hour @Temperature 149 °F
Resinlab® EP1285HD-9 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Cure Time	90.0 - 120 min @Temperature 149 °C	1.50 - 2.00 hour @Temperature 300 °F
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP30 Optically Clear, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30 is a low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP38CL Adhesive Features Toughness and Durability Description: Master Bond EP38CL is a lower viscosity, optically clear two component epoxy system for high performance bonding, coating, sealing and small encapsulations, featuring toughness and dura..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP41S-1 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP41S-1 is a two component epoxy resin system designed for durable, high performance bonding, sealing, coating and encapsulating. It successfully withstands prolonged imm..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP75-1 Graphite Filled Electrically Conductive Epoxy System Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more ..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP76M-F Electrically Conductive, Two Part Epoxy Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or ..
Cure Time	60.0 - 120 min @Temperature >=79.4 °C	1.00 - 2.00 hour @Temperature >=175 °F
Master Bond MB600S Aqueous Based Sodium Silicate System for EMI/RFI Shielding Description: Master Bond MB600S is a silver containing aqueous based sodium silicate system used as a coating in situations where EMI shielding effectiveness is paramount. Electromagnetic interferen..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat..
Cure Time	60.0 - 120 min @Temperature 125 °C	1.00 - 2.00 hour @Temperature 257 °F
Tra-Con Tra-Bond 933-2 Moisture Resistant Chip Encapsulant TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical..
Cure Time	60.0 - 120 min @Temperature 65.0 °C	1.00 - 2.00 hour @Temperature 149 °F
Trelleborg Emerson & Cuming Eccobond® 1309 General Purpose Catalyst Emerson & Cuming 1309 Eccobond® General Purpose CatalystFaster curing version of 9. Very fast room temperature curing, low viscosity, general purpose. Short working life. Imparts excellent chemical..
Cure Time	60.0 - 120 min @Temperature 65.0 °C	1.00 - 2.00 hour @Temperature 149 °F
Trelleborg Emerson & Cuming Eccobond® 24 LV General Purpose Catalyst Emerson & Cuming 24 LV Eccobond® General Purpose CatalystFaster curing, shorter working life version of 23 LV. Recommended for small mass castings due to higher exotherm. Cure Type: Room Temp or He..
Cure Time	60.0 - 120 min @Temperature 65.0 °C	1.00 - 2.00 hour @Temperature 149 °F
Trelleborg Emerson & Cuming Eccobond® 43 Heat Cure Catalyst Emerson & Cuming 43 Eccobond® Heat Cure CatalystRoom temperature gelling version of 28. Excellent for low stress potting and bonding. Will post cure in actual use. Combines the benefits of both 9 a..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP30-2 Low Outgassing, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly a..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP34 Room Temperature Curing Two Component Epoxy System Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond Supreme 11AO Electrically Isolating Adhesive and Sealant Description: Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated..
Cure Time	60.0 - 120 min @Temperature 25.0 °C	1.00 - 2.00 hour @Temperature 77.0 °F	tack free
Cytec Conathane® CE-1175 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time	60.0 - 120 min @Temperature 82.222 - 98.889 °C	1.00 - 2.00 hour @Temperature 180.00 - 210.00 °F
Abatron AboTar 8607-1 Solventless Tar-Epoxy Compound AboTar 8607-1 is a 2-part tar-epoxy lower cost system for filling and leveling pot holes and grossly uneven flooring. It can be used neat or with sand or aggregates. Uses: Resurfacing concrete and ..
Cure Time	60.0 - 120 min @Temperature 180 °C	1.00 - 2.00 hour @Temperature 356 °F
Abatron AboWeld 8708-5 One-Component Structural/Dielectric Epoxy AboWeld 8708-5 is a highly filled, class H (180°C) structural, heat-conductive adhesive paste for SLOW high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating;..
Cure Time	60.0 - 120 min @Temperature 93.0 - 105 °C	1.00 - 2.00 hour @Temperature 199 - 221 °F
Abatron ROCKWELD 55-27 A/B Structural Adhesive Putty; Epoxy ROCKWELD 55-27 is a 2-component epoxy system with low density, high-strength, and no shrinkage. It is a structural adhesive putty for sculpturing, repairs and restoration of stone, concrete and maso..
Cure Time	60.0 - 120 min @Temperature 150 - 160 °C	1.00 - 2.00 hour @Temperature 302 - 320 °F
Abatron AboCast 8501-6 One-Component Epoxy AboCast 8501-6 is a clear, high-temperature one-component epoxy system for very high-temperature uses. It offers the highest heat resistance of the clear resins. Suggested Uses: Casting; Potting; E..
Cure Time	60.0 - 120 min @Temperature 150 - 160 °C	1.00 - 2.00 hour @Temperature 302 - 320 °F
Abatron AboCast 8504-1 One-Component Epoxy AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications.
Cure Time	60.0 - 120 min @Temperature 150 - 160 °C	1.00 - 2.00 hour @Temperature 302 - 320 °F
Abatron AboCast 8504-5 One-Component Epoxy AboCast 8504-5 is a clear, plasticized one-component epoxy system with very high strength and impact. It provides exceptional physical properties and thermal shock resistance from sub-zero to modera..
Cure Time	60.0 - 120 min @Temperature 93.3 °C	1.00 - 2.00 hour @Temperature 200 °F
Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..