Polymer Property : Cure Time = 15.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	15.0 min @Temperature 113 °C	0.250 hour @Temperature 235 °F
Parker Chomerics CHO-BOND 584-29 Conductive Adhesive Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m..
Cure Time	15.0 min @Temperature 23.0 °C	0.250 hour @Temperature 73.4 °F	M10 steel, handling strength
Permabond HH040 Anaerobic Retainer Permabond® HH040 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure unitiz..
Cure Time	15.0 min @Temperature 23.0 °C	0.250 hour @Temperature 73.4 °F	Zinc, handling strength
Permabond MM115 Anaerobic Threadlocker Permabond® MM115 Threadlocker is an excellent general purpose threadlocker and sealant. It is used for locking metal bolts, nuts and screws that may require disassembly for service and maintenance...
Cure Time	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	for higher property development
Tra-Con Tra-Bond 2222 One-Part Surface Mount Epoxy Adhesive TRA-BOND 2222 is a solvent-free, one-part thixotropic, epoxy adhesive recommended for SMD (Surface Mount Device) bonding and sealing applications where its easy handling, high strength and superior ..
Cure Time	>= 15.0 min @Temperature 100 °C	>= 0.250 hour @Temperature 212 °F
Tra-Con Tra-Bond 2222 One-Part Surface Mount Epoxy Adhesive TRA-BOND 2222 is a solvent-free, one-part thixotropic, epoxy adhesive recommended for SMD (Surface Mount Device) bonding and sealing applications where its easy handling, high strength and superior ..
Cure Time	15.0 min @Temperature 100 °C	0.250 hour @Temperature 212 °F
Tra-Con Tra-Bond F230 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the..
Cure Time	15.0 min @Temperature 100 °C	0.250 hour @Temperature 212 °F
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio..
Cure Time	15.0 min @Temperature 100 °C	0.250 hour @Temperature 212 °F
Tra-Con Tra-Bond 723C01 One-Part Medical Grade Adhesive TRA-BOND 723C01 is a fast, heat curing, one component adhesive targeted at medical applications. The material complies with USP Class VI toxicity requirements and is resistant to gamma sterilization..
Cure Time	15.0 min @Temperature 90.0 °C	0.250 hour @Temperature 194 °F	1 drop applications
Tra-Con Tra-Bond F109CLR Fiber Optic Epoxy Adhesive TRA-BOND F109CLR is a clear, low viscosity epoxy specially designed for terminating plastic fibers. This blush free epoxy is an excellent choice for high humidity environments where absolute clarity..
Cure Time	15.0 min @Temperature 150 °C	0.250 hour @Temperature 302 °F	Bond Line
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Cure Time	15.0 min @Temperature 150 °C	0.250 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Cure Time	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Cure Time	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 41300R062 0.062" Uncured Silicone Rubber on Holland Cloth Design/Construction:Interleave: 3.0 mil PolyethyleneSide 1: Uncured Silicone RubberCarrier: Holland ClothThis data represents typical values for the production material and should not be used as m..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 55578R036 0.036" (0.914 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction: Interleave: PolyethyleneSide 2, Layer 2: Uncured Silicone Rubber Side 2, Layer 1: Cured Silicone Rubber Substrate: Style 162 Fiberglass Side 1: Cured Silicone Rubber Appearance:..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 55579R028M 0.029" (0.737 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side This data Represents typical values for the production material. The data should not be used to write, or in place of, m..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 55579R033 0.033" (0.838 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured layer on top of a cured layer on one side Appearance: Red silicone gum and rubber on fiberglass clothThis data Represents typical values for the production materi..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 56606R026M 0.026" (0.660 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone Rubber Side 2: Uncured Silicone Rubber Product Use: Flexible heater insulationAppearance: Red silicone gum and rubber on fiberglass with polymer release li..
Cure Time	15.0 - 20.0 min @Temperature 121 - 177 °C	0.250 - 0.333 hour @Temperature 250 - 350 °F	Recommended Cure Cycle
Arlon CP-310R Bulk Compound Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl..
Cure Time	15.0 - 20.0 min @Temperature 121 - 177 °C	0.250 - 0.333 hour @Temperature 250 - 350 °F	Recommended Cure Cycle
Arlon CP-434R Bulk Compound Appearance: Red silicone gumThis data represents typical values for the production material. The data should not be used to write, or in place of, material specifications.Information provided by Arl..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon R33920W028 0.028" (0.711 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone Rubber Appearance: White gum on glass fiber fabricThis data Represents typical values for the production material. The data should not be used to write, ..
Cure Time	15.0 min @Temperature 141 °C	0.250 hour @Temperature 285 °F	Recommended Cure Cycle
Arlon R35948R015 0.0155" (0.394 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Interleave: Polyethylene Side 1, Layer 2: Uncured Silicone RubberSide 1, Layer 1: Cured Silicone Rubber Substrate: Style 7628 Fiberglass Side 2: Cured Silicone RubberThis data re..
Cure Time	15.0 min @Temperature 100 °C	0.250 hour @Temperature 212 °F
Atom Adhesives AA-DUCT 903 Epoxy Adhesive AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less tha..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 51268R015P 0.015" (0.381 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction: Interleave: Polyethylene Side 2, Layer 2: Uncured Silicone Rubber Side 2, Layer 1: Cured Silicone Rubber Substrate: Style 7628 FiberglassSide 1: Cured Silicone RubberThis data r..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 51426R020 0.020" Cured/Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSubstrate: Prime Coated 7628 FiberglassSide 2: Uncured Silicone RubberInterleave: 3 mil PolyethyleneThis data represents typical values for the pr..
Cure Time	15.0 min @Temperature 177 °C	0.250 hour @Temperature 350 °F	Recommended Cure Cycle
Arlon 55578XA030M 0.0305" (0.775 mm) Uncured/Cured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Cured Silicone RubberSide 2: Cured/Uncured Layers This data Represents typical values for the production material. The data should not be used to write, or in place of, m..
Cure Time	15.0 min @Temperature 60.0 °C	0.250 hour @Temperature 140 °F	10% cure
BCC Products BC 9060 Silicone RTV Rubber BC 9060 is a blue colored, two-component, flowable compound that, regardless of thickness or confinement, cures at room temperature or by application heat. The cured rubber is high strength and high..
Cure Time	15.0 min @Temperature 23.0 °C	0.250 hour @Temperature 73.4 °F	M10 steel, handling strength
Permabond MH052 Anaerobic Threadsealant Permabond® MH052 is ideal for the sealing of threaded joints. It is approved for use with natural gas and LPG for working pressure up to 20 bar (290 psi) and also for gaseous oxygen up to 10 bar (1..