Parker Chomerics CHO-BOND 584-29 Conductive Adhesive

Category	Polymer , Adhesive , Thermoset
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 584-29 Conductive Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the material is offered in convenient premeasured "CHO-PAK" for rapid application. CHO-BOND® adhesive meets the most exacting electrical bonding requirements without the high temperatures, fluxes and expensive preparatory techniques usually needed to obtain effective lead-tin solder joints.Information provided by Chomerics

Physical Properties	Metric	English	Comments
Specific Gravity	2.30 - 2.70 g/cc	2.30 - 2.70 g/cc
Thickness	25.4 microns	1.00 mil	Recommended

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 8.27 MPa	>= 1200 psi
	4.48 MPa @Treatment Temp. 21.0 °C, Time 86400 sec	650 psi @Treatment Temp. 69.8 °F, Time 24.0 hour	Lap
	6.21 MPa @Treatment Temp. 65.0 °C, Time 7200 sec	900 psi @Treatment Temp. 149 °F, Time 2.00 hour	Lap

Thermal Properties	Metric	English
CTE, linear	49.0 µm/m-°C @Temperature 20.0 °C	27.2 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	1.20 - 1.50 W/m-K	8.33 - 10.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	125 °C	257 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.0090 ohm-cm @Treatment Temp. 65.0 °C, Time 7200 sec	<= 0.0090 ohm-cm @Treatment Temp. 149 °F, Time 2.00 hour
	<= 0.050 ohm-cm @Treatment Temp. 21.0 °C, Time 86400 sec	<= 0.050 ohm-cm @Treatment Temp. 69.8 °F, Time 24.0 hour

Processing Properties	Metric	English	Comments
Cure Time	15.0 min @Temperature 113 °C	0.250 hour @Temperature 235 °F
	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F
	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F
Pot Life	>= 30 min	>= 30 min
Shelf Life	9.00 Month @Temperature 21.0 °C	9.00 Month @Temperature 69.8 °F	Bulk; From date of manufacture
	12.0 Month @Temperature 21.0 °C	12.0 Month @Temperature 69.8 °F	Bi-Paks; From date of manufacture

Descriptive Properties	Value	Comments
Binder	Epoxy
Color	Silver/gray
Consistency	Thin Paste
Coverage	156.1 cm²/g
Filler	Ag
Mix Ratio	100:6.3	584 : Hardener
Working Life	0.5 hr

Users viewing this material also viewed the following: