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Parker Chomerics CHO-BOND 584-29 Conductive Adhesive

Category Polymer , Adhesive , Thermoset
Manufacturer Parker Chomerics
Trade Name CHO-BOND
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Parker Chomerics CHO-BOND 584-29 Conductive Adhesive.pdf
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Material Notes:
Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the material is offered in convenient premeasured "CHO-PAK" for rapid application. CHO-BOND® adhesive meets the most exacting electrical bonding requirements without the high temperatures, fluxes and expensive preparatory techniques usually needed to obtain effective lead-tin solder joints.Information provided by Chomerics
Physical Properties Metric English Comments
Specific Gravity 2.30 - 2.70 g/cc
2.30 - 2.70 g/cc
Thickness 25.4 microns
1.00 mil
Recommended
Mechanical Properties Metric English Comments
Shear Strength >= 8.27 MPa
>= 1200 psi
4.48 MPa

@Treatment Temp. 21.0 °C,
Time 86400 sec
650 psi

@Treatment Temp. 69.8 °F,
Time 24.0 hour
Lap
6.21 MPa

@Treatment Temp. 65.0 °C,
Time 7200 sec
900 psi

@Treatment Temp. 149 °F,
Time 2.00 hour
Lap
Thermal Properties Metric English Comments
CTE, linear 49.0 µm/m-°C

@Temperature 20.0 °C
27.2 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 1.20 - 1.50 W/m-K
8.33 - 10.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.0090 ohm-cm

@Treatment Temp. 65.0 °C,
Time 7200 sec
<= 0.0090 ohm-cm

@Treatment Temp. 149 °F,
Time 2.00 hour
<= 0.050 ohm-cm

@Treatment Temp. 21.0 °C,
Time 86400 sec
<= 0.050 ohm-cm

@Treatment Temp. 69.8 °F,
Time 24.0 hour
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 113 °C
0.250 hour

@Temperature 235 °F
1440 min

@Temperature 24.0 °C
24.0 hour

@Temperature 75.2 °F
1440 min

@Temperature 24.0 °C
24.0 hour

@Temperature 75.2 °F
Pot Life >= 30 min
>= 30 min
Shelf Life 9.00 Month

@Temperature 21.0 °C
9.00 Month

@Temperature 69.8 °F
Bulk; From date of manufacture
12.0 Month

@Temperature 21.0 °C
12.0 Month

@Temperature 69.8 °F
Bi-Paks; From date of manufacture
Descriptive Properties Value Comments
Binder Epoxy
Color Silver/gray
Consistency Thin Paste
Coverage 156.1 cm2/g
Filler Ag
Mix Ratio 100:6.3
584 : Hardener
Working Life 0.5 hr
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