Polymer Property : Pot Life = 45 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	45 - 60 min	45 - 60 min	Mass: 100g; TM R050-17
Resinlab® EP1285HD-9 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Pot Life	45 min	45 min
NextGen Adhesives G907-28 Potting Adhesive Description: NGAC G907-28 is a medium viscosity adhesive system formulated with a spherical glass filler to provide light weight and low shrinkage performance.Advantages and Applications: The NGAC G..
Pot Life	45 min	45 min
NextGen Adhesives M907-11 Medical Grade Epoxy Adhesive Description: NGAC M907-11 is a medium viscosity adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include laminating, bonding..
Pot Life	45 min	45 min
NextGen Adhesives M907-19 Medical Grade Epoxy Adhesive Description: NGAC M907-19 is a medium viscosity and thixotropic adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include lam..
Pot Life	45 min @Temperature 25.0 °C	45 min @Temperature 77.0 °F
Parker Chomerics Tecknit® 72-00008 Silver-Filled Epoxy System Description: This commercial grade, conductive epoxy is designed for use in bonding applications where good conductivity is required. When mixed in a ratio of 1:1.4 by volume or weight, the two comp..
Pot Life	45 min @Temperature 25.0 °C	45 min @Temperature 77.0 °F
Parker Chomerics Tecknit® 72-08116 Silver-Filled Epoxy System Description: This is a silver filled epoxy system designed for maximum performance and lowest volume resistivity. It is easily mixed 1:1 by volume or weight, from the two one-ounce jars. Its consist..
Pot Life	45 min	45 min	Ambient
Reltek BONDiT™ B-536 Adhesive System Key Properties: Very high strength bonding of dissimilar materials.High moisture and solvent resistance.Fast ambient cure with good pot life.Ease of use.Applications: Outstanding adhesive for very h..
Pot Life	45 min	45 min	Mass: 100g; TM R050-19
Resinlab® EP1385 Black Epoxy Formulation Resinlab™ EP1385 Black is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Pot Life	45 min	45 min	Mass: 100g; TM R050-19
Resinlab® EP1385 Clear Epoxy Formulation Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w..
Pot Life	45 min	45 min	Mass: 200g; TM R050-19
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor..
Pot Life	>= 45 min	>= 45 min
Abatron 2231 A/B Filled Potting Compound (discontinued **) Lower viscosity filled potting, encapsulating, and casting system. Gray and most colors. 5/1 variable ratio.Information provided by Abatron.
Pot Life	>= 45 min	>= 45 min
Abatron 416 A/B Filled Potting Compound (discontinued **) Phosphorescent litegreen resin. 100/26 ratio.Information provided by Abatron.
Pot Life	45 - 60 min	45 - 60 min
Aremco Aremco-Bond™ 597 Conductive Epoxy Adhesive (discontinued **) Electrically and thermally conductive, silver-filled, one-part paste. Inorganic system for adhesive (597A) & coating (597C) applications to 1200 ºF (650 °C).
Pot Life	45 min	45 min	25 grams
Tra-Con Tra-Bond 2119 Low Viscosity Glass Laminating Adhesive TRA-BOND 2119 is a crystal clear adhesive specifically designed for bonding glass to glass and glass to plastics. It also yields a high lap shear strength to metals and ceramics. This system cures t..
Pot Life	45 min	45 min
Tra-Con Tra-Bond FDA2 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and rec..
Pot Life	45 min	45 min
Tra-Con Tra-Bond FS482 Long Pot Life High Tg Fiber Optic Epoxy Adhesive TRA-BOND FS-482 is a dark blue, low viscosity epoxy adhesive developed for fiber-optic bonding and small volume potting of plastic or glass optical fibers, lenses and prisms, LED displays, and other..
Pot Life	45 - 75 min	45 - 75 min	100 gram mass
Master Bond EP30M4 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP30M4 is a two component epoxy system for high performance bonding, sealing and encapsulation. This system features a forgiving 100 to 60 mix ratio by weight. EP30M4 resi..
Pot Life	45 min	45 min
Dow Corning 3631 PART A&B KIT Two-part, solvent free, heat-cured liquid silicone rubber.Information provided by Dow Corning
Pot Life	45 min	45 min
Abatron AboWeld 8505-1 A/B Silver-Filled Electrically Conductive Epoxy Compound AboWeld 8505-1 A/B is a solventless silver-epoxy adhesive and resurfacer. It has high rigidity, chemical and heat resistance. It also has good adhesion to most rigid materials.
Pot Life	45 min	45 min	100 g
Abatron AboCast 7802-1/AboCure 50-12 Epoxy AboCast 7802-1 is a clear resin with low viscosity (600-800 cps.) and a weight of 9.1 lbs/gallon. AboCure 50-12 is a clear converter for high rigidity, chemical, and temperature resistance (HDT: 101..
Pot Life	45 - 60 min	45 - 60 min	Mass: 100g; TM R050-19
Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and ..
Pot Life	45 min	45 min	Mass: 5g; TM R050-19
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit..
Pot Life	45 - 75 min	45 - 75 min	100 gram mass
Master Bond EP39MHT Two Component, Room Temperature Curing Epoxy Resin System Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to..
Pot Life	45 - 75 min	45 - 75 min	100 gram batch
Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding ..