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Reltek BONDiT™ B-536 Adhesive System

Category Polymer , Adhesive , Thermoset
Manufacturer Reltek LLC
Trade Name BONDiT™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Reltek BONDiT™ B-536 Adhesive System.pdf
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Material Notes:
Key Properties: Very high strength bonding of dissimilar materials.High moisture and solvent resistance.Fast ambient cure with good pot life.Ease of use.Applications: Outstanding adhesive for very high strength potting and assembly applications. Bonds most plastics, metals, glass and ceramics. Good for electronics applications. High moisture resistance. Full cure 60 minutes at ambient or 10 minutes at 170º F or higher temperatures for faster cure down to 15 sec.
Physical Properties Metric English Comments
Viscosity 2500 cP
2500 cP
Mechanical Properties Metric English Comments
Tensile Strength at Break 51.15 MPa
7418 psi
Ambient Cure
Tensile Strength, Ultimate 53.04 MPa
7693 psi
Peak; Ambient Cure
Tensile Strength, Yield 53.04 MPa
7693 psi
Ambient Cure
Elongation at Break 9.2 %
9.2 %
Ambient Cure
Elongation at Yield 8.6 %
8.6 %
Ambient Cure
Processing Properties Metric English Comments
Cure Time 60.0 min
1.00 hour
Ambient
Pot Life 45 min
45 min
Ambient
Descriptive Properties Value Comments
Color Clear with slight amber
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