Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
32.8 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP FARADEX NS003 PC+ABS LNP* FARADEX* NS003 is a compound based on PC+ABS resin containing 15% Stainless Steel. Added features of this material include: Electrically Conductive, EMI/RFI Shielding. |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
32.8 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP FARADEX NS003 PC+ABS (Asia Pacific) LNP* Faradex* NS003 is a compound based on PC+ABS Blend resin containing Stainless Steel. Added features of this material include: Electrically Conductive, EMI/RFI Shielding. |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
32.8 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP FARADEX NS003 PC+ABS (Europe-Africa-Middle East) LNP* Faradex* NS003 is a compound based on PC+ABS Blend resin containing Stainless Steel. Added features of this material include: Electrically Conductive, EMI/RFI Shielding. |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
32.8 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP DB0049F PC LNP* THERMOCOMP* DB0049F is a compound based on Polycarbonate resin containing 20% Glass Bead. Added features of this material include: Flame Retardant, Superior Molding. |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature -40.0 - 40.0 °C |
32.8 µin/in-°F @Temperature -40.0 - 104 °F |
ISO 11359-2 |
SABIC Innovative Plastics LNP THERMOCOMP DB0049F PC (Asia Pacific) LNP* Thermocomp* DB0049F is a compound based on Polycarbonate resin containing Glass Bead, Flame Retardant. Added features of this material include: Flame Retardant, Superior Molding. |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature 180 °C |
32.8 µin/in-°F @Temperature 356 °F |
DIN 53752 |
BASF Ultrason® E 2010 MR SW 10111 PESU Description: Unreinforced, medium viscosity standard injection molding grade, demolding optimized. Abbreviated designation according to ISO 1043-1: PESU.Information provided by BASF |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature 180 °C |
32.8 µin/in-°F @Temperature 356 °F |
DIN 53752 |
BASF Ultrason® E 3010 MR UN PESU Description: Unreinforced, higher viscosity injection molding and extrusion grade with improved toughness and chemical resistance (stress crack resistance); demolding optimized. Abbreviated designat.. |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature 140 - 180 °C |
32.8 µin/in-°F @Temperature 284 - 356 °F |
ISO 11359-1/-2 |
BASF Ultrason E 1010 PES Ultrason E 1010 is an unreinforced, low viscosity injection molding PES grade. It flows readily and offers outstanding heat resistance and dimensional stability. |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature 180 °C |
32.8 µin/in-°F @Temperature 356 °F |
DIN 53752 |
BASF Ultrason® E 2010 HC PESU Information provided by BASF |
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CTE, linear, Parallel to Flow | 59.0 µm/m-°C @Temperature 180 °C |
32.8 µin/in-°F @Temperature 356 °F |
DIN 53752 |
BASF Ultrason® E 2010 SW Q31 10088 PESU Information provided by BASF |