Thermal Properties | Metric | English | Comments |
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Solidus | 1080 °C | 1980 °F | |
Osprey Metals HTN 5 Brazing Powder Particle size distribution 1-250 microns.SHAPE: Predominantly spherical PACKAGING: 4 & 20 Kg. Chemical composition and particle size distribution can be adjusted to suit customers' requireme.. |
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Solidus | 1080 °C | 1980 °F | |
CMW® ELKONITE® 2140C Copper Tungsten Nickel material For structural rotors.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® ELKONITE® 30W3 Infiltrated Copper Tungsten contact material ASTM B702, Class E, infiltrated, RWMA Class 12 For projection welding dies, die facing, and resistance welding electrodes. Also used for low expansion structural members. Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® ELKONITE® 3W3 Tungsten Copper material ASTM B702 For arcing and current carrying electrical contacts, power transformer contacts, resistance welding electrodes.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® ELKONITE® 3W53 Heat Treatable Tungsten Copper material For resistance welding electrodes.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® ELKONITE® 40W3 Infiltrated Tungsten Copper material ASTM B702 For vacuum switch contacts, low expansion structural members.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® ELKONITE® 50W3 Tungsten Copper material ASTM B702 For vacuum switch contacts.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® ELKONITE® 5W3 Tungsten Copper material ASTM B702, Class C, infiltrated For arcing and current carrying electrical contacts; power transformer contacts.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® THERMKON® 62 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® THERMKON® 65M Molybdenum Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® THERMKON® 68 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® THERMKON® 70M Molybdenum Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® THERMKON® 76 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
CMW® THERMKON® 83 Tungsten Copper parts For matching CTE of semiconductor substrates while allowing high thermal transfer.Information provided by CMW Inc. |
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Solidus | 1080 °C | 1980 °F | |
Kennametal Stellite Nucalloy® 430 High-Silicon Nickel-Base Hardfacing Alloy Applications include components of chemical processing.Nucalloy® alloys are unique, patented, high-silicon, nickel-base hardfacing alloys that are designed to have optimum combinations of hardness .. |