Polymer Property : Thermal Conductivity = 9.00 BTU-in/hr-ftÂ²-Â°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ftÂ²-Â°F	ASTM C177
Techmer ES HiFillÂ® PP 0123 C Polypropylene Availability: North AmericaForms: PelletsFeatures: Copolymer and Thermally ConductiveInformation provided by TP Composites, Inc.
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP112FLAO-1 Toughened, Two component, Heat Curing Epoxy Master Bond EP112FLAO-1 is a toughened two component, high performance epoxy resin system featuring very good temperature resistance, fine thermal conductivity and electrical insulation values with ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP30AOHT Dimensionally Stable, Two Component Epoxy Description: Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance bonding, potting, sealing and coating, formulated to cure at room temperature or more rapi..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP45HTAO Heat Resistant Epoxy for Structural Bonding Description: Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where ..
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ft²-°F
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ft²-°F
Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond FLM36 B-staged film for high performance bonding and sealing Master Bond FLM36 is a film adhesive with exceptional strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master ..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond Supreme 10AOHT-LO High Shear and Peel Strength Epoxy Description: Master Bond Supreme 10AOHT-LO has a combination of properties consisting of excellent thermal conductivity, superior electrical insulation, great adhesion to a wide variety of substrate..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP42HT-2AO-1 Two Part, Cryogenically Serviceable Epoxy Description: Master Bond EP42HT-2AO-1 Black is a room temperature curable, two component epoxy adhesive, sealant, coating and casting material that meets NASA low outgassing specifications. It featu..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond Supreme 11AOHTLO Epoxy Passes NASA Low Outgassing Tests Description: Master Bond Supreme 11AOHTLO is a two component epoxy resin system for high performance bonding and sealing. Although, it is formulated to cure at room temperature, the best cure schedu..
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ft²-°F
Aremco Aremco-Bond™ 568 High Performance Epoxide Aluminum-Filled, 1:1, Good Bond Strength and High Thermal Conductivity.
Thermal Conductivity	1.30 W/m-K	9.00 BTU-in/hr-ft²-°F
Aremco AREMCOLOX™ 502-1100 (Full-Fired) Dense Alumino-Silicate Good mechanical strength, and electrical and thermal resistance. For producing insulators, standoffs, feed-thrus, furnace carriers and brazing fixtures. Fabricate and fire yourself using conventio..
Thermal Conductivity	1.30 - 1.44 W/m-K	9.00 - 10.0 BTU-in/hr-ft²-°F
Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat..