Thermal Properties | Metric | English | Comments |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Parker Chomerics CHO-BOND 1056, Part B Silicone Resin Mixture Information provided by Chomerics |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Parker Chomerics CHO-BOND 1069, Part B Silicone Rubber Mixture Information provided by Chomerics |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Parker Chomerics CHO-BOND 4041 Part B Conductive Adhesive Information provided by Chomerics |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Parker Chomerics CHO-BOND SV713 Conductive Epoxy CHO-BOND® 700 Series Adhesives for Microelectronics Packaging; these pure silver-filled epoxy pastes are designed to meet the demanding requirements of semiconductor and microelectronic packaging. .. |
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Flash Point | >= 93.3 °C | >= 200 °F | Uncured |
Resin Technology Group CT-523LV Cationic UV Cure Epoxy Adhesive CT-523-LV is an epoxy-based, low viscosity, cationic-curable adhesive and/or sealant. This product is activated by exposure to medium intensity UV radiation resulting in a high strength, chemical re.. |
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Flash Point | >= 93.3 °C | >= 200 °F | Uncured |
Resin Technology Group DP031199-1 Cationic UV Cure Epoxy Adhesive DP031199-1 is an epoxy-based, low-viscosity, cationic-curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a strong, chemically resistant, lo.. |
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Flash Point | >= 93.3 °C | >= 200 °F | Uncured |
Resin Technology Group UV-408 Low-Viscosity, High Clarity, UV Curable Adhesive UV 408 is a low viscosity, high clarity, UV curing adhesive with excellent adhesion to glass. The product is well suited for bonding close fitting parts and has excellent moisture resistance.Applica.. |
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Flash Point | >= 93.3 °C | >= 200 °F | Uncured |
Resin Technology Group UV-412 Medium Viscosity, High Clarity, UV Curable Adhesive UV 412 is a high clarity, fast setting UV adhesive. This solvent free adhesive is designed to bond a wide variety of transparent materials, (similar and dissimilar substrates). The high clarity prov.. |
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Flash Point | >= 93.3 °C | >= 200 °F | Uncured |
Resin Technology Group MX-2212 High Impact, Multi-Functional, UV Curing Adhesive This multi-functional product is a rapid setting structural adhesive. UV-MX 2212 provides high impact, resilient bonds to many similar and dissimilar substrates. Multi-functional cure bonds are form.. |
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Flash Point | >= 93.3 °C | >= 200 °F | Uncured |
Resin Technology Group UV-403 High Clarity, Structural Polycarbonate and PVC Bonder UV 403 is a very fast UV curing adhesive developed for bonding a variety of plastics. Bond strengths on polycarbonate and rigid PVC usually exceed the strength of those substrates. Bond lines are cl.. |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Lord Adhesives 18 Mix-In Accelerator for use with all Lord Acrylic Adhesives Lord Adhesives 18 Mix-In Accelerator for use with all Lord Acrylic AdhesivesLord Accelerator 18 Black Mix-In Accelerator for use with all Lord Acrylic Adhesives. May be used at ratios from 2:1 throu.. |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Lord Adhesives 4 No-Mix Accelerator for 200/500 Series Lord Adhesives 4 No-Mix Accelerator for 200/500 SeriesLord Accelerator 4 is a no mix accelerator for Lord 200 and 500 series acrylic adhesives. Brush, wipe, spray or dip on one or both surfaces to b.. |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Lord Adhesives 7713 Adhesion Increaser to SMC Lord Adhesion Enhancers/Surface ModifiersTo meet the unique bonding demands that accompany the use of difficult-to-bond materials, the Lord Corporation offers a full line of adhesion enhancers/surfa.. |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Lord Adhesives 17 Mix-In Accelerator for 200, 400, 500 Series Lord Adhesives 17 Mix-In Accelerator for 200, 400, 500 SeriesLord Accelerator 17 mix-in accelerator for Lord 200, 400 and 500 series acrylic adhesives. Use at a 10:1 ratio. |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Lord Adhesives 19B Mix-In Black Accelerator for 200, 400, 500 Series Lord Adhesives 19B Mix-In Black Accelerator for 200, 400, 500 SeriesLord Accelerator 19 Black Mix-in accelerator. Use at 2:1 or 4:1 ratio for Lord 200, 400 and 500 Series Acrylic Adhesives. Well-sui.. |
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Flash Point | 93.3 °C | 200 °F | |
Lubriplate Minus 70 Petroleum-Based Heavy-Duty Hydraulic Oil ISO 15 petroleum-based oil for low temperature applications. Low Temp Hydraulic Oils are available in Jugs, Pails, 1/4 Drums & Drums.Information provided by Lubriplate |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Dow BETAMATE™ 73705 Polyurethane BETAMATE™ 73705 is a one-part moisture curing polyurethane trim adhesive. It is formulated to provide adhesion to electro galvanized steel, phosphated steel, E-coated steel, and trim materials use.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC EP AEP EPI Engineered Polymers EP AEP is a new generation of Internetwork Polymers of polyurea and Epoxy, “Powered by Reactamine® Technology”. EP AEP was developed for a colorfast floor for both residential and industrial appl.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC EP EF EPI Engineered Polymers Extra Flex Polyurea EP EF, Extra Flex Polyurea, “Powered by Reactamine® Technology, is a two component 100% solid Polyurea, with superior performance in industrial applications. EP EF displays extremely fast cure tim.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC EP RAP-1567 EPI Engineered Polymers Aliphatic Polyurea RAP-1567 HX is a two component 100% solids, no VOC’s, aliphatic polyureas “Powered by ReactAmine® Technology” that was developed for UV stable (colorfast) polyurea applications. This new generat.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC EP RAP-1567 SP-HX EPI Engineered Polymers Silicone Aliphatic Polyurea RAP-1567 SP is a two component 100% solids, no VOC’s, silicone aliphatic polyureas “Powered by ReactAmine® Technology” that was developed for UV stable (colorfast) polyurea applications. This ne.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC EP RAP-1567 SP-HX EPI Engineered Polymers Silicone Aliphatic Polyurea RAP-1567 SP-HX is a two component 100% solids, no VOC’s, silicone aliphatic polyureas “Powered by ReactAmine® Technology” that was developed for UV stable (colorfast) polyurea applications. This.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC EP RSP-AL EPI Engineered Polymers Aromatic Silicone Polyurea EP RSP-AL, Aromatic Silicone Polyurea, “Powered by Reactamine® Technology”, is a two component 100% solid Polyurea. This increases UV resistance without sacrificing physical properties. EP RSP-AL.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC SMP™ EP EF SP EPI Engineered Polymers Extra Flex with Silicone EP EF SP, “Powered by Reactamine® Technology”, is a two component 100% solid Silicone Polyurea with superior performance in industrial applications. EP EF SP displays extremely fast cure times wi.. |
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Flash Point | >= 93.3 °C | >= 200 °F | |
3M Scotchgard™ 18 Low Maintenance Floor Finish Scotchgard Low Maintenance 18 Floor Finish, a high quality water-based co-polymer emulsion, is an economical finish designed to provide exceptional performance for low traffic areas and low frequenc.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC SMP™ EP 1009 EPI Engineered Polymers Silicone Modified Polymer EP 1009, “Powered by Reactamine®Technology”, is a two component 100% solid Silicone Modified Polyurea with superior performance in industrial applications. EP 1009 displays extremely fast cure ti.. |
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Flash Point | >= 93.3 °C | >= 200 °F | ASTM Pensky-Martin |
ACC EP RAP 45 14 EPI Engineered Polymers Aliphatic Polyurea EP RAP 45 14 Aliphatic Polyurea, “Powered by Reactamine® Technology”, is a two component 100% solids, no VOC’s, aliphatic polyurea coating that was developed for UV stable (colorfast) polyurea f.. |
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Flash Point | >= 93.3 °C | >= 200 °F | |
Solvay RHODASURF® BC-840 Surfactant Chemical Name: TRIDECYL ALCOHOL ETHOXYLATEDCAS: 78330-21-9Available in: Asia Pacific, Europe, Latin America and North America Applications: RHODASURF BC-840 is used for the following applications: f.. |