Thermal Properties | Metric | English | Comments |
---|---|---|---|
Glass Transition Temp, Tg | 300 °C | 572 °F | DMA (Tan d Peak); IPC-TM-650.2.4.24.3 |
Park Electrochemical Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a.. |
|||
Glass Transition Temp, Tg | 300 °C | 572 °F | DMA (Tan d Peak); IPC-TM-650.2.4.24.3 |
Park Electrochemical Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a.. |
|||
Glass Transition Temp, Tg | >= 300 °C | >= 572 °F | |
Hybrid Plastics POSS® EP 2000 Epoxy Adhesive EP2000 is a POSS® based, ultra-high temperature epoxy adhesive. The POSS® content in EP2000 offers unique properties such as high thermal stability, outstanding oxygen and chemical resistance... |
|||
Glass Transition Temp, Tg | 300 °C | 572 °F | Dry |
Hexcel® HexPly® M65 Bismaleimide Resin HexPly® M65 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® M65 is a controlled flow polyimide resin.. |