Category | Polymer , Thermoset , Epoxy |
Manufacturer | Park Electrochemical Corp. |
Trade Name | Nelco® |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Park Electrochemical Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.73 g/cc | 0.0625 lb/in³ | 50% resin content |
Water Absorption | <= 0.050 % | <= 0.050 % | IPC-TM-650.2.6.2.1 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Modulus of Elasticity | 20.7 GPa | 3000 ksi | X; ASTM D3039 |
20.7 GPa | 3000 ksi | Y; ASTM D3039 | |
Poissons Ratio | 0.14 | 0.14 | X; ASTM D3039 |
0.14 | 0.14 | Y; ASTM D3039 | |
Peel Strength | 1.31 kN/m | 7.50 pli | 1 oz. Cu, at elevated temperature; IPC-TM-650.2.4.8.2a |
1.40 kN/m | 8.00 pli | 1 oz. Cu, after exposure to process solutions; IPC-TM-650.2.4.8 | |
1.40 kN/m | 8.00 pli | 1 oz. Cu, after solder float; IPC-TM-650.2.4.8 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 11.0 - 13.0 µm/m-°C @Temperature -40.0 - 125 °C |
6.11 - 7.22 µin/in-°F @Temperature -40.0 - 257 °F |
X/Y; IPC-TM-650.2.4.41 |
Glass Transition Temp, Tg | 240 °C | 464 °F | TMA; IPC-TM-650.2.4.24c |
250 °C | 482 °F | DSC; IPC-TM-650.2.4.25c | |
300 °C | 572 °F | DMA (Tan d Peak); IPC-TM-650.2.4.24.3 | |
Decomposition Temperature | 376 °C | 709 °F | TGA; 5% wt. loss; IPC-TM-650.2.4.24.6 |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | 1.00e+13 ohm-cm | 1.00e+13 ohm-cm | C - 96/35/90; IPC-TM-650.2.5.17.1 |
1.00e+13 ohm-cm | 1.00e+13 ohm-cm | E - 24/125; IPC-TM-650.2.5.17.1 | |
Surface Resistance | 1.00e+13 ohm | 1.00e+13 ohm | C - 96/35/90; IPC-TM-650.2.5.17.1 |
1.00e+13 ohm | 1.00e+13 ohm | E - 24/125; IPC-TM-650.2.5.17.1 | |
Dielectric Constant | 3.5 @Frequency 1.00e+10 Hz |
3.5 @Frequency 1.00e+10 Hz |
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5 |
3.6 @Frequency 1.00e+10 Hz |
3.6 @Frequency 1.00e+10 Hz |
50% Resin Content; Split Post Cavity | |
3.6 @Frequency 2.50e+9 Hz |
3.6 @Frequency 2.50e+9 Hz |
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5 | |
3.7 @Frequency 1.00e+9 Hz |
3.7 @Frequency 1.00e+9 Hz |
50% Resin Content; RF Impedance; IPC-TM-650.2.5.5.9 | |
Dielectric Strength | 65.0 kV/mm | 1650 kV/in | IPC-TM-650.2.5.6.2 |
Dielectric Breakdown | >= 50000 V | >= 50000 V | IPC-TM-650.2.5.6 |
Dissipation Factor | 0.0070 @Frequency 1.00e+10 Hz |
0.0070 @Frequency 1.00e+10 Hz |
50% Resin Content; Split Post Cavity |
0.011 @Frequency 2.50e+9 Hz |
0.011 @Frequency 2.50e+9 Hz |
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5 | |
0.011 @Frequency 1.00e+10 Hz |
0.011 @Frequency 1.00e+10 Hz |
50% Resin Content; Stripline; IPC-TM-650.2.5.5.5 | |
Arc Resistance | 160 sec | 160 sec | IPC-TM-650.2.5.1 |
Descriptive Properties | Value | Comments |
---|---|---|
Methylene Chloride Resistance (% Weight Change) | 0.34 | IPC-TM-650.2.3.4.3 |
Pressure Cooker | Pass | 60 min then solder dip @288°C until failure (max 10 min.); IPC-TM-650.2.6.16 (modified) |
T260 (minutes) | 60+ | IPC-TM-650.2.4.24.1 |
T288 (minutes) | 30+ | IPC-TM-650.2.4.24.1 |
Z Axis Expansion (%) | 2.5 | 50-260°C; IPC-TM-650.2.4.41 |