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Hexcel® HexPly® M65 Bismaleimide Resin

Category Polymer , Thermoset , Polyimide, TS
Manufacturer Hexcel
Trade Name HexPly®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Hexcel® HexPly® M65 Bismaleimide Resin.pdf
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Material Notes:
HexPly® M65 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® M65 is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing. It has improved tack levels and performs well for fiber placement applications.Information provided by HexCel
Physical Properties Metric English Comments
Specific Gravity 1.246 g/cc
1.246 g/cc
Moisture Absorption at Equilibrium 3.8 %
3.8 %
Mechanical Properties Metric English Comments
Fracture Toughness 0.967 MPa-m½
0.880 ksi-in½
Thermal Properties Metric English Comments
Glass Transition Temp, Tg 225 °C
437 °F
Wet
300 °C
572 °F
Dry
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