Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | TM R050-25 |
Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | |
Resin Technology Group TIGA 110-EXDP Low Viscosity, Optically Clear Glass Bonder Mix ratio 100/50 by volume.TIGA 110EX-DP is a transparent, low viscosity epoxy resin formulation recommended for industrial adhesive, small potting and laminating applications where sparkling clarit.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | TMA |
Lord Adhesives Thermosetâ„¢ MD-110 Conductive Adhesive LORD Thermosetâ„¢ MD-110 silver-filled conductive adhesive offers excellent electrical conductivity and room temperature stability. It is designed for use with automated dispensing, stamping and.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | |
Unitika elitel UE3203 Polyester, Pellet High elongation type UE3200UNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as adhesives, paints, ink binders,.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | |
Unitika elitel UE3380 Polyester, Flake Low molecular weight type UE3200, Low softening point, High OH typeUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | Ultimate Tg |
Tra-Con Tra-Duct 916H01 Electronically Conductive Silver-Filled Epoxy TRA-DUCT 916H01 is an electronically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical .. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | Ultimate Tg |
Tra-Con Tra-Bond F109CLR Fiber Optic Epoxy Adhesive TRA-BOND F109CLR is a clear, low viscosity epoxy specially designed for terminating plastic fibers. This blush free epoxy is an excellent choice for high humidity environments where absolute clarity.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 103FHS NC010 Nylon 66
(Unverified Data**) Unreinforced Heat Stabilized Polyamide 66 Zytel 103FHS NC010 is a heat stabilized internally lubricated polyamide 66 resin for injection molding. It was developed for fast cycles and high productivi.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® 132F NC010 Nylon 66
(Unverified Data**) Unreinforced Nucleated Polyamide 66 Zytel 132F NC010 is a nucleated lubricated polyamide 66 for injection molding. It was developed for fast production cycles and high productivity applications.Info.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | DAM; 10°C/min; ISO 11357-1/-2 |
DuPont Performance Polymers Zytel® FN727 NC010A Nylon 6
(Unverified Data**) Toughened Polyamide 6Information provided by DuPont Performance Polymers |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | DSC 3146 |
Bond Laminates TEPEX® dynalite 102-RG600(x)/47% Roving Glass – PA 6 Consolidated Composite Laminate Within the TEPEX® composite laminate, Polyamide 6 is a resin known for its toughness, stiffness, abrasion resistance, heat and chemical resistances. Roving E-Glass fibers have an excellent impact .. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | |
Armstrong A-12 Epoxy Adhesive, at 1:1 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | |
3M Scotch-Weld™ DP805 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP805 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact and durability .. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | |
Loctite® Durabond® E-20HP Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli.. |
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Glass Transition Temp, Tg | 60.0 - 170 °C | 140 - 338 °F | Average value: 97.6 °C Grade Count:12 |
Overview of materials for Epoxy, Molded, Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Glass Fiber Filler". Each property range of values reported is minimum and maximum values.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | TM R050-25 |
Resinlab® EP1046FG Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1046FG Black is a two part unfilled very fast curing electronic grade epoxy encapsulant designed for small castings (less than 25 grams). It cures very quickly with low exotherm to a to.. |
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Glass Transition Temp, Tg | 60.0 °C | 140 °F | |
Loctite® Output™ 383 Acrylic Adhesive Acrylic Bonding Adhesives and Thermally Conductive BondersLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impa.. |