Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | Dry; DMA |
Park Electrochemical Nelcote® E-766B Epoxy Prepreg, 120 E-Glass Reinforced Nelcote® E-766B is a low tack, self adhesive epoxy resin system designed for honeycomb applications. E-766B displays excellent peel properties.Key Features and Benefits:Self adhesive resin system f.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | Dry; DMA |
Park Electrochemical Nelcote® E-766B Epoxy Prepreg, 285 Kevlar® Reinforced Nelcote® E-766B is a low tack, self adhesive epoxy resin system designed for honeycomb applications. E-766B displays excellent peel properties.Key Features and Benefits:Self adhesive resin system f.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | Dry; DMA |
Park Electrochemical Nelcote® E-766B Epoxy Prepreg, 7581 E-Glass Reinforced Nelcote® E-766B is a low tack, self adhesive epoxy resin system designed for honeycomb applications. E-766B displays excellent peel properties.Key Features and Benefits:Self adhesive resin system f.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | Dry; DMA |
Park Electrochemical Nelcote® E-766B Epoxy Prepreg, 7781 E-Glass Reinforced Nelcote® E-766B is a low tack, self adhesive epoxy resin system designed for honeycomb applications. E-766B displays excellent peel properties.Key Features and Benefits:Self adhesive resin system f.. |
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Glass Transition Temp, Tg | 93.0 - 153 °C | 199 - 307 °F | Average value: 131 °C Grade Count:6 |
Overview of materials for Nylon 6-3 This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6-3". Each property range of values reported is minimum and maximum values of appropriate MatWeb e.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | TMA |
Lord Adhesives Thermosetâ„¢ MD-150 Conductive Adhesive LORD Thermosetâ„¢ MD-150 silver-filled conductive adhesive offers excellent electrical and thermal conductivity. It is designed for use with automated dispensing, stamping and screen-printing app.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | wet |
Henkel Hysol EA 9628H Film Adhesive First generation, modified epoxy film, high peel strength, good stress, environmental resistance and structural propertiesApplications: Composite Bonding, Metal & Honeycomb BondingData from .060 psf.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | wet |
Henkel Hysol EA 9896 WPP Peel Ply Pre-impregnated, nylon peel ply product supplied in film form. Specially designed resin system capable of curing at 250°F / 121°C. Compatible with state-of-the-art composite prepreg resin syst.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | Ultimate Tg |
Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | |
Epoxyset Epoxibond EB-348 Low Expansion Epoxy Adhesive EB-348 is a highly filled, extremely low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional .. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | |
Atom Adhesives AA-BOND 428 Epoxy Adhesive AA-BOND 428 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. AA-BOND 428 contains .. |
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Glass Transition Temp, Tg | 93.0 °C | 199 °F | |
Atom Adhesives AA-BOND 2112 Epoxy Adhesive AA-BOND 2112 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |