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- Polymer Property : Glass Transition Temp, Tg = 90.0 °C
Polymer Property : Glass Transition Temp, Tg = 90.0 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 90.0 °C | 194 °F | Average value: 90.0 °C Grade Count:13 |
| Overview of materials for Polyphenylene Sulfide (PPS), Mineral/Glass-Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyphenylene Sulfide (PPS), Mineral/Glass-Fiber Filled". Each property range of values reported is mini.. |
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| Glass Transition Temp, Tg | 90.0 °C | 194 °F | ASTM D882-63A, Modified |
| Lord Adhesives Fusor® 380NS / 383NS Epoxy Adhesive LORD Fusor® 380NS/383NS adhesive is a two-part, rapid-cure epoxy adhesive used to bond fiberglass reinforced plastics (FRP), sheet molded compounds (SMC) and metals.All information provided by Lo.. |
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| Glass Transition Temp, Tg | 90.0 °C | 194 °F | ASTM E1356 |
| Solvay Specialty Polymers Hyflon® AD 40H Perfluoropolymer Hyflon® AD 40H is an amorphous perfluoro-polymer available in powder form. Hyflon® AD polymers resemble semicrystalline perfluoropolymers in their performance properties as they exhibit high t.. |
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| Glass Transition Temp, Tg | 90.0 °C | 194 °F | ISO 11357-2 |
| Solvay Specialty Polymers Ryton® QC160N Polyphenylene Sulfide (PPS) Ryton® QC160N (granular powder) unfilled polyphenylene sulfide exhibits excellent thermal stability and chemical resistance and is suitable for thermoplastic extrusion processes.Features: Good Ch.. |
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| Glass Transition Temp, Tg | 90.0 °C | 194 °F | DSC |
| Wolf Kunststoff ZEDEX® ZX-530EL3 066 Polymer Alloy, Carbon Fiber Reinforced Main Characteristics: Low thermal expansion; High rigidity; High yield stress; High wear resistance; Low friction; Stress ResistantApplications: Chemical Engineering; Laboratory Technology; Automitv.. |
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| Glass Transition Temp, Tg | 90.0 °C | 194 °F | Ultimate Tg |
| Tra-Con Tra-Bond F110 Optically Transparent Low Viscosity Epoxy Adhesive TRA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. This room temperature curing system is an excellent choice for thin bond-line assembly and repair applications of prisms.. |
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| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan.. |
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| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® bra.. |
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| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl.. |
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| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope.. |
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| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Post-Cure Dynamic Scan 20200°C; Ramp -40200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE.. |
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| Glass Transition Temp, Tg | >= 90.0 °C | >= 194 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N.. |
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| Glass Transition Temp, Tg | 90.0 °C | 194 °F | |
| Atom Adhesives AA-BOND F110 Epoxy Adhesive AA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. AA-BOND F110 is room temperature system an excellent choice for thin bond-line assembly and repair applications of prisms.. |
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