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- Polymer Property : Glass Transition Temp, Tg = 80.0 °C
Polymer Property : Glass Transition Temp, Tg = 80.0 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 80.0 °C | 176 °F | 10°C/min; DAM; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 70G30L NC010 Nylon 66
(Unverified Data**) Zytel® 70G30L NC010 is a 30% glass fiber reinforced polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC method |
| Honeywell Aegis™ OX High Barrier Nylon
(discontinued **) Description: Aegis OX is an oxygen-scavenging nylon. Oxygen barrier is comparable to a glass bottle with metal crown closure. In addition Aegis OX provides CO2 barrier and possesses glass-like cla.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | MCI Method |
| Mitsui APELâ„¢ APL6509T Cyclo Olefin Copolymer (COC) This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
| SK Chemicals SKYGREEN® PETG 2008 Specially Formulated PET Copolymer Resin SKYGREEN PETG is an amorphous copolyester in which a certain amount of ethylene glycol is replaced with 1,4-cyclohexane dimethanol (CHDM), which prevent crystallization, leading to improved processa.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
| Zeus FEP Tubing FEP, fluorinated ethylene propylene, is a melt processable fluoropolymer that allows for long, continuous lengths and has several distinct advantages over PTFE. Applications where FEP tubing is usua.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
| Tra-Con Tra-Bond 2143G Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143G is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
| Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devi.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
| Tra-Con Tra-Bond 9059D Rigid Unfilled Epoxy Adhesive TRA-BOND 9059D rigid, unfilled epoxy adhesive exhibits good dimensional stability for gyro applications. This material is a blue-green color.Information provided by Tra-Con Inc. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
| Tra-Con Tra-Cast 3103 General Purpose Epoxy Casting Compound TRA-CAST 3103 is a low viscosity two-part formulation recommended for general purpose electrical potting and encapsulating application where the combination of good mechanical thermal and electrical.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg, 10°C/min; TMA |
| Tra-Con Tra-Bond 526M05 Rapid Low Temperature Cure Adhesive TRA-BOND 526M05 is a low viscosity, fast cure at low temperature, long pot-life adhesive. Information provided by Tra-Con Inc. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
| Eastman Cadence™ GS4 Copolyester for film calendering Eastman Cadence™ copolyester, for calendered films, is a specialty plastic developed to meet the demand for an environmentally responsible material for the calendering industry. Available in diffe.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
| Eastman Drystar 0601 Copolyester, Injection Molded This product-line is designed to meet the needs of converters seeking value-added solutions to their drying requirements of copolyesters. Eastman’s copolyesters are highly valued for their excellen.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
| Eastman Eastar GN007 PETG Copolyester ISO data as provided by the manufacturer, Eastman Chemical |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
| Eastman Eastman 1223 Copolyester Applications:Blown filmCredit cardsDebit cardsDeodorant packagingElectronic packagingFabricated boxesFlexible packagingFood packagingFurniture/Furniture trimGaming cardsGift cardsIdentification card.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
| Eastman GSP01 Copolyester for Film and Sheet Extrusion Applications:Consumer e-packaging trayElectronic packagingElectrostatic dissipative trayProduct Description: GSP01 is a clear, amorphous material. Because of its clarity, toughness and good melt s.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two .. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 70G30L NC010 Nylon 66
(Unverified Data**) 30% Glass Reinforced Polyamide 66Zytel 70G30L NC010 is a 30% glass fiber reinforced polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 70G43HSLA BK099 Nylon 66
(Unverified Data**) 43% Glass Reinforced Heat Stabilized Polyamide 66 Zytel 70G43HSLA BK099 is a 43% glass fiber reinforced heat stabilized black polyamide 66 resin for injection molding.Information provided by DuPont .. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
| Epoxyset Epoxibond EB-301 Low Expansion Epoxy Adhesive EB-301 is a highly filled, low expansion, epoxy adhesive. This low out-gassing adhesive exhibits excellent wettability without preheating metal bonding surfaces and has a good dimensional stability .. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 70G25HSLR NC010 Nylon 66
(Unverified Data**) 25% Glass Reinforced Heat Stabilized Hydrolysis Resistant Polyamide 66 Zytel 70G25HSLR NC010 is a 25% glass fiber reinforced heat stabilized hydrolysis resistant polyamide 66 resin for injection mol.. |
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