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Polymer Property : Melting Point = 338 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Melting Point 160 - 170 °C
320 - 338 °F
Cured State
Palm Labs Adhesives TURBO FUSE METHYL FOR METALS (75-95 Viscosity) Rapid Bonding Adhesive
Palm Lab's Methyl Cyanoacrylate is a one component rapid bonding adhesive ideal for metal surfaces. TURBO FUSE METHYL’s advanced formula is designed to polymerize instantly by absorbing surface moi..
Melting Point 160 - 170 °C
320 - 338 °F
Cured State
Palm Labs Adhesives Turbo Fuse Series 115SI Surface Insensitive (20 Viscosity) Rapid Bonding Adhesive
Palm Lab's Cyanoacrylate is a one component rapid bonding adhesive. TURBO FUSE SERIES 115SI – SURFACE INSENSITIVE advanced formula is designed to polymerize instantly by absorbing surface moisture...
Melting Point 160 - 170 °C
320 - 338 °F
ASTM D3418
NatureWorks® Ingeo™ 6400D Fiber Grade PLA
NatureWorks® PLA polymer 6400D is a thermoplastic fiber-grade resin derived primarily from annually renewable resources. Available in pellet form, 6400D is designed for extrusion into mechanically ..
Melting Point 160 - 170 °C
320 - 338 °F
Average value: 166 °C Grade Count:13
Overview of materials for Acetal Copolymer, Mineral Filled
This property data is a summary of similar materials in the MatWeb database for the category "Acetal Copolymer, Mineral Filled". Each property range of values reported is minimum and maximum values ..
Melting Point 142 - 170 °C
288 - 338 °F
0.025" extruded film,
Huntsman IROGRAN® PS442-202 TPU-Polyester
Introduction: IROGRAN PS440-202 is a high performance polyester based thermoplastic polyurethane intended for extrusion and injection molding applications. IROGRAN PS440-202 is part of the HUNTSMAN ..
Melting Point 150 - 170 °C
302 - 338 °F
ISO 3146-C
FKuR Kunststoff Bio-Flex® F 6513 Compostable PLA Blend
The BIO-FLEX® trade name indicates blends of co-polyester and PLA* with, depending on the particular grade, a very high content of natural resource material. BIO-FLEX® does not contain any sta..
Melting Point 150 - 170 °C
302 - 338 °F
ISO 3146-C
FKuR Kunststoff Bio-Flex® S 9533 Compostable PLA Blend
The BIO-FLEX® trade name indicates blends of co-polyester and PLA* with, depending on the particular grade, a very high content of natural resource material. BIO-FLEX® does not contain any sta..
Melting Point 131 - 170 °C
268 - 338 °F
Indium Corp. Indalloy 99 Bismuth-Lead-Tin Solder Alloy
Information Provided by Indium Corporation
Melting Point 130 - 170 °C
266 - 338 °F
LG Chemical SEETEC H1501 Polypropylene Homopolymer
Features: SEETEC H1501 is a homopolymer for injection molding. H1501 is specifically developed for application demanding a high stiffness and a high fluidity. SEETEC H1501 meets the FDA requirement ..
Melting Point 140 - 170 °C
284 - 338 °F
LG Chemical SEETEC H7500 Polypropylene, Homopolymer
Features: Seetec H7500 is designed for the extrusion of continuous filament (CF). This grade is characterized by medium MWD and good processability from specific additives. SEETEC H7500 meets the FD..
Melting Point 140 - 170 °C
284 - 338 °F
LG Chemical SEETEC H7630 Polypropylene, Homopolymer
Features: Seetec H7630 is designed for the extrusion of continuous filament (CF) & bulk continuous filament (BCF) fibers and staple fibers. This grade is characterized by medium MWD, with anti-gas f..
Melting Point 130 - 170 °C
266 - 338 °F
LG Chemical SEETEC M1500 Polypropylene Impact Copolymer
SEETEC M1500 is a heterophasic polypropylene copolymer for injection molding applications. SEETEC M1500 exhibits a high flowability and a good balance of stiffness and impact strength. SEETEC M1500 ..
Melting Point 130 - 170 °C
266 - 338 °F
LG Chemical SEETEC M1600 Polypropylene Impact Copolymer
Features: SEETEC M1600 is a heterophasic polypropylene copolymer for injection molding applications. SEETEC M1600 exhibits a high flowability and a good balance of stiffness and impact strength. SEE..
Melting Point 130 - 170 °C
266 - 338 °F
LG Chemical SEETEC R1610 Polypropylene Random Copolymer
Features: SEETEC R1610 is a highly transparent ethylene-propylene random copolymer for injection molding applications. SEETEC R1610 exhibits an excellent transparency and a good impact strength. SEE..
Melting Point 130 - 170 °C
266 - 338 °F
LG Chemical SEETEC R3400 Polypropylene Random Copolymer
Features: Seetec R3400 is a polypropylene-ethylene random copolymer designed for non-transparent injection molding application. SEETEC R3400 meets the FDA requirement in the code of Federal Regulati..
Melting Point 130 - 170 °C
266 - 338 °F
LG Chemical SEETEC R3420 Polypropylene, Random Copolymer
Features: Seetec R3420 is a polypropylene-ethylene random copolymer designed for the production of cast films. It has a good clarity due to the optimum content of ethylene and offers optimum balance..
Melting Point 138 - 170 °C
280 - 338 °F
Indium Corp. Indalloy 281-338 Bismuth-Tin Solder Alloy
Information Provided by Indium Corporation
Melting Point 120 - 170 °C
248 - 338 °F
Gromax Paraformaldehyde 9%
Information provided by Gromax Enterprises Corp.
Melting Point 164 - 170 °C
327 - 338 °F
ISO 3146
Borealis Bormod™ HD915CF Polypropylene Homopolymer for Cast Film
Bormod HD915CF is a high crystallinity homopolymer film resin, based on special Borstar nucleating technology, especially developed for the manufacturing of unoriented film for metallizing. It is s..
Melting Point 165 - 170 °C
329 - 338 °F
[10 K/min], ISO 11357
Eurotec® Tecolen® HP10 GR30 NL HS PPCP, 30% glass fiber reinforced, heat stabilized, natural
Information provided by Eurotec®
Melting Point 165 - 170 °C
329 - 338 °F
[10 K/min], ISO 11357
Eurotec® Tecolen® HP10 GR10 NL PPCP, 10% glass fiber reinforced, natural
Information provided by Eurotec®
Melting Point 165 - 170 °C
329 - 338 °F
[10 K/min], ISO 11357
Eurotec® Tecolen® HP30 NL XC30 PPHP, flame retardant - halogen (RoHS compliant), heat stabilized, natural
Information provided by Eurotec®
Melting Point 160 - 170 °C
320 - 338 °F
BCC Products BC 100 Thin Cyanoacrylate Adhesive
BC100 Thin is a low viscosity material ideal for bonding larger areas. BC100 Thin has a 20 second fixture cure and able to fill gaps of .002” wide. BC100 Thin is perfectly designed for bonding plas..
Melting Point 138 - 170 °C
280 - 338 °F
AIM 40Bi/60Sn Solder for Photonic Packaging
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
Melting Point 130 - 170 °C
266 - 338 °F
LG Chemical SEETEC R7700 Polypropylene, Random Copolymer
Features: Seetec R7700 is designed for the extrusion of fibers with the spunbond technology. This grade is characterized by narrow MWD and good processability. SEETEC R7700 meets the FDA requirement..
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