- HOME
- POLYMER SEARCH
- Polymer Property : Minimum Service Temperature, Air = -67.0 °F
Polymer Property : Minimum Service Temperature, Air = -67.0 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics CHO-SHIELD® 4076 Conductive Coating CHO-SHIELD® 4076 nickel-filled polyurethane is recommended for shielding an entire room. This durable coating adheres well to plaster, wood, glass, concrete, drywall and most metals.Information pro.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Cured |
| Parker Chomerics Tecknit® 73-00008 Electrically Conductive Acrylic and Polyurethane Paint Description: TECKNIT manufactures a highly conductive acrylic and polyurethane paints filled with silver. These coatings provide a cost effective method for shielding and grounding plastic enclosure.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Parker Chomerics Tecknit Consil®-E 815 Extruded Silver-Filled Silicone Elastomer Description: CONSIL-E is a continuously extruded silicone elastomer filled with silver-plated inert particles. It is a medium hardness material providing high electrical conductivity and moisture se.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Glass |
| Parker Chomerics Tecknit Teckshield®-F 145 OPI 0.0022" Diameter Wire, High Performance EMC Window Description: TECKSHIELD-F high-performance fully laminated flat windows are specially designed to provide optimum optical transmission and EMI shielding in severe interference environments. TECKSHIE.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ITW Plexus Plexusâ„¢ MA1021 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.All purpose, low shrinkage.Information provided by Illinois Tool Works. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ITW Plexus Plexusâ„¢ MA3940 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Use with craze sensitive plastics.Information provided by Illinois Tool Works. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ITW Plexus Plexusâ„¢ MA1025 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low shrinkage, low odor, able to be used 1" thick.Information provided by Illinois Tool Works. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Trelleborg Emerson & Cuming Stycast® 2057FR/11 Two-Component Epoxy Flame Retardant Encapsulant Features and Typical ApplicationsProvide flame resistance down to 1/8 of an inch. These products also offer various other features such as thermal shock protection, low viscosity, and thermal conduc.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® B9021-6 Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® EK2000 Epoxy Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® H31D-LV Epoxy Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® OG198-54 UV Cure Optical Epoxy Material Description: Single component, low viscosity, high Tg, UV curable epoxy. Active alignment of optics, securing fibers into V-grooves and fiber pigtails are a few of its common applications... |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Intermittent |
| Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ACC QGel 311 QSI Quantum Silicones General Purpose Silicone Gel QGel 311 is a clear, fast cure, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ACC QM 245 QSI Quantum Silicones 45 Durometer Addition Cure Moldmaking Material QM 245 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th.. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| ACC QM 264 QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material QM 264 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties, good shelf-life stability, excellent physical properties and resin .. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Aremco Aremco-Bond™ 2315 High Performance Epoxide High Temperature, Low Viscosity, Potting Compound for Electrical Applications. |
|||
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | |
| Dow Corning 3120 RTV SILICONE RUBBER Two-part, red, condensation cure, moderate flow, high temperature performance, UL HB, cure speed varied by catalyst type and mix ratio.Information provided by Dow Corning |
|||
Copyright © lookpolymers.com All Rights Reserved