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Polymer Property : Minimum Service Temperature, Air = -269 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -269 - -46.1 °C | -452 - -51.0 °F | Average value: -94.4 °C Grade Count:12 |
| Overview of materials for Epoxy, Cast, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr.. |
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| Minimum Service Temperature, Air | -269 - 15.6 °C | -453 - 60.0 °F | Average value: -62.8 °C Grade Count:115 |
| Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o.. |
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| Minimum Service Temperature, Air | -269 - -20.0 °C | -452 - -4.00 °F | Average value: -58.3 °C Grade Count:47 |
| Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val.. |
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| Minimum Service Temperature, Air | -269 - -20.0 °C | -452 - -4.00 °F | Average value: -66.1 °C Grade Count:93 |
| Overview of materials for Epoxy, Electrically Conductive This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Electrically Conductive". Each property range of values reported is minimum and maximum values of.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Continuous; DIN 52612 |
| Isoflon PEHD 1000 High Density Polyethylene Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
| Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
| Master Bond EP37-3FLF Low Exotherm Highly Flexible Two Component Epoxy Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. The .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl.. |
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
| Master Bond Supreme 10HT One Component, Low Outgassing, Toughened Epoxy System Master Bond Supreme 10HT features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. Supreme 10HT is room temperature storable and .. |
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
| Master Bond Supreme 10HTS Silver Filled Electrically Conductive One Part Epoxy Master Bond Supreme 10HT/S is a one component, no mix high purity silver conductive system formulated to cure at elevated temperatures. Tensile shear strengths greater than 1,200 psi and T-peel stre.. |
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
| Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It is formulated to cure fully at ambie.. |
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| Minimum Service Temperature, Air | -269 °C | -453 °F | |
| Master Bond EP29LPSP Low Outgassing, Optically Clear Two Component Epoxy Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100EN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100VN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100ZT Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200A Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an ar.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200EN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications requ.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 300ZT Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 500A Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50KN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dian.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200VN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available in.. |
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