Mechanical Properties | Metric | English | Comments |
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Adhesive Bond Strength | 5.86 MPa | 850 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (.. |
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Adhesive Bond Strength | 5.86 - 24.1 MPa | 850 - 3500 psi | Average value: 12.8 MPa Grade Count:26 |
Overview of materials for Epoxy Cure Resin This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Cure Resin". Each property range of values reported is minimum and maximum values of appropriate M.. |
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Adhesive Bond Strength | >= 5.86 MPa | >= 850 psi | shear, Al/Al |
Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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Adhesive Bond Strength | >= 5.86 MPa | >= 850 psi | shear, Al/Al |
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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Adhesive Bond Strength | >= 5.86 MPa | >= 850 psi | shear, Al/Al, after 30 days water immersion |
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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Adhesive Bond Strength | >= 5.86 MPa | >= 850 psi | shear, Al/Al |
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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Adhesive Bond Strength | >= 5.86 MPa | >= 850 psi | shear, Al/Al |
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength.. |
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Adhesive Bond Strength | >= 5.86 MPa @Temperature 23.0 °C |
>= 850 psi @Temperature 73.4 °F |
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Master Bond EP79 Two Component, Silver Coated, Nickel Filled Conductive Epoxy Master Bond Polymer System EP79 is a two component, silver coated, nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or .. |
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Adhesive Bond Strength | >= 5.86 MPa @Temperature 23.0 °C |
>= 850 psi @Temperature 73.4 °F |
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Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit.. |
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Adhesive Bond Strength | >= 5.86 MPa | >= 850 psi | shear, Al/Al |
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap.. |
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Adhesive Bond Strength | 5.86 MPa | 850 psi | Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37 |
Resinlab® SEC1222 Silver Filled Epoxy Adhesive Resinlab™ SEC1222 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1222 provides excellent electrical conductivit.. |