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Polymer Property : Particle Size = 20 µm Product List
Physical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Particle Size | <= 20 µm | <= 20 µm | 90% smaller than |
| Nyco NYAD® MD400 Wollastonite Powdered grade.Wollastonite is a naturally occurring white mineral with an acicular (needle-shaped) particle structure. This distinctive particle morphology makes wollastonite an ideal performance m.. |
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| Particle Size | <= 20 µm | <= 20 µm | 99% of particles less than |
| Old Hickory APG-300 Kentucky Ball Clay This is an extremely low 325 Mesh wet residue clay. It can be employed in a variety of applications where high purity mineral filler is required. It has a moderate GE brightness value and is particu.. |
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| Particle Size | <= 20 µm | <= 20 µm | 99% finer |
| Malvern Minerals Novacite® Daper Untreated Lamellar Quartz Filler/Extender Novacite® quartz silica has closely controlled sizing that is used extensively in the coatings field. Novacite® has broad acceptance as silica in special purpose, product finishes OEM, automo.. |
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| Particle Size | 20 µm | 20 µm | 98% finer than |
| Imerys Carverâ„¢ Kaolin Information provided by Imerys |
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| Particle Size | 20 µm | 20 µm | 98% finer than |
| Imerys Ewingâ„¢ Kaolin Ewing is an intermediate grained air-floated kaolin which is selected, processed and controlled to meet specific requirements of the fibreglass industry.Information provided by Imerys |
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| Particle Size | 20 µm | 20 µm | 96% finer than |
| Imerys Kaolin Slurryâ„¢ Kaolin Slurry is a carefully controlled Kaolin-water suspension formulated for use in cermic castings.Information provided by Imerys |
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| Particle Size | >= 20 µm | >= 20 µm | trace |
| Imerys Minsparâ„¢ 1 Feldspar Minspar 1 is a minus 30 mesh Feldspar product used in the glass container and ceramic tile markets.Information provided by Imerys |
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| Particle Size | <= 20 µm | <= 20 µm | >50 |
| Solvay Chemicals Ixper® 75C Calcium Peroxide IXPER® 75C is a Calcium Peroxide powder used in a wide range of applications in environmental, seed coating, baking and oil drilling e.g. marketsEINECS Number: 215-139-4/CAS Number: 1305-79-9Info.. |
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| Particle Size | 20 µm | 20 µm | |
| Silberline Sparkle Silver® 3346-ST Sparkle Silver® 3346-ST is a medium, bright, non-leafing aluminum pigment with excellent hiding power. It has slightly more sparkle than Sparkle Silver® 3333-AR. It provides exceptional bright.. |
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| Particle Size | 20 µm | 20 µm | Springback 13%, pressure 0.477 t/cc |
| TIMCAL TIMREX® KS75 Primary Synthetic Graphite TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro.. |
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| Particle Size | 20 µm | 20 µm | 99.9% less than value (Size E) |
| Vesta Ceramics SicoMill® Grade 2 Silicon Powder General Description:SicoMill® is a fine-grained silicon powder, specially developed for the ceramic industry. We have five standard grinding grades, but we can produce powders adapted to single cu.. |
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| Particle Size | 20 µm | 20 µm | D90 |
| Dandong Taico Minerals TAICOCITE® TC8 Magnesium Hydroxide Made from local natural brucite minerals, TAICOCITE® is the name of milled magnesium hydroxide products which is produced (micronized/surface treated) by Dandong Taico Minerals Co., Ltd. TAICOCITE®.. |
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-11 Aurora Pink DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-17 Saturn Yellow DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
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| Particle Size | 20 - 60 µm | 20 - 60 µm | |
| DayGlo ZQ Pigments ZQ-21 Corona Magenta DAY-GLO ZQ-Pigments are an improved version of DAY-GLO Z-Pigments. They offer lower mold plateout, increased plastic compatibility, are mostly stronger, require processing temperatures, and have lar.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.Info.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: .. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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| Particle Size | <= 20 µm | <= 20 µm | |
| Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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| Particle Size | 20 µm | 20 µm | 10th% |
| 3M S35 Glass Bubbles 3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli.. |
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| Particle Size | <= 20 µm | <= 20 µm | 3rd Streak; Fineness of Grind |
| Gwent Electronic Materials C2030304D2 Aluminum Ink C2030304D2 is designed as a screen printing ink for termination of Barium Titanate based PTC devices.This Ink is in a ready to use form at a viscosity suitable for automatic or semiautomatic screen .. |
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