Lord Adhesives Metech 3610 Gold Alloy Conductor Composition

Category	Polymer , Adhesive
Manufacturer	Lord Adhesives
Trade Name	Metech
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Lord Adhesives Metech 3610 Gold Alloy Conductor Composition.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Gold alloy conductor composition 3610 is a mixed bond composition designed for microcircuit applications requiring aluminum wire bonds. It offers excellent aged wire bond adhesion for both aluminum and gold wires. The composition fires at 850Â°C to a dense, pin-hole free film with a typical fired thickness of 9-11 microns. The vehicle system permits resolution of 125 micron lines and spaces.All information provided by Lord.

Physical Properties	Metric	English	Comments
Brookfield Viscosity	190000 - 240000 cP @Temperature 25.0 Â°C	190000 - 240000 cP @Temperature 77.0 Â°F	HBT, Spindle #SC4-14 @ 10rpm
Thickness	9.00 - 11.0 microns	0.354 - 0.433 mil	Fired

Electrical Properties	Metric	English	Comments
Surface Resistivity per Square	<= 0.0040 ohm	<= 0.0040 ohm

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature 25.0 Â°C	12.0 Month @Temperature 77.0 Â°F

Descriptive Properties	Value	Comments
Coverage (cmÂ²/gm)	50-60	Calculated from 50 micron wet film
Line Resolution (microns)	125
Wire Bond Strength (grams)	13-15	Ultrasonic Aluminum, Initial
	7-9	Ultrasonic Aluminum, Aged (300ÂºC for 1 hour)
	8-10	Thermosonic Gold, Aged (300ÂºC for 1 hour)
	9-11	Thermosonic Gold, Initial

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