Polymer Property : Mold Temperature = 345 Â°F Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Mold Temperature	174 - 182 Â°C	345 - 360 Â°F	injection molding.
Sumitomo Bakelite North America 2004B Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Mold Temperature	174 - 182 Â°C	345 - 360 Â°F	injection molding.
Sumitomo Bakelite North America 4064 Mineral Filled Electrical Encapsulation Grade Epoxy Rogers electrical encapsulation grade epoxy is recommended for capacitors, resistors, gold lead encapsulation, relays, coils and bobbins.Information provided by Sumitomo Bak North America, Inc.
Mold Temperature	174 - 182 Â°C	345 - 360 Â°F	injection molding.
Sumitomo Bakelite North America 1907-1 / 1907B-1 Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.
Mold Temperature	174 - 182 Â°C	345 - 360 Â°F	injection molding.
Sumitomo Bakelite North America 2008A Glass Reinforced Hardware Grade Epoxy Epoxy is the premier material for military firewall connectors.Information provided by Sumitomo Bak North America, Inc.